Micro-printing of ceramic packaging for sensor integration

Tobias Schaedler; Kayleigh A. Porter; Alex C. Yu; Erin S. Wernick; Souren Soukiazian; Trevor Sasse; Christina M. Seeholzer; Bor-An C. Tu; Courtney P. Wilt; Souheil Nadri; John A. Carlson; Jacob M. Hundley; Mark R. O'Masta; Binh-Minh Nguyen; Peter D. Brewer

doi:10.1117/12.2648588

17 March 2023 Micro-printing of ceramic packaging for sensor integration

Tobias Schaedler, Kayleigh A. Porter, Alex C. Yu, Erin S. Wernick, Souren Soukiazian, Trevor Sasse, Christina M. Seeholzer, Bor-An C. Tu, Courtney P. Wilt, Souheil Nadri, John A. Carlson, Jacob M. Hundley, Mark R. O'Masta, Binh-Minh Nguyen, Peter D. Brewer

Author Affiliations +

Proceedings Volume PC12433, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVI; PC124330H (2023) https://doi.org/10.1117/12.2648588
Event: SPIE OPTO, 2023, San Francisco, California, United States

Abstract

We present on the additive micro-manufacturing of ceramic packaging, containing arbitrarily routed vias with a diameter and pitch as small as 10µm and 20µm, respectively. We accomplish this feat by pairing recently commercialized micro-printers based on digital micromirror devices with our UV curable pre-ceramic resin that enables dielectric ceramic printing. Ceramic interposers with thousands of vias were 3D printed, then metallized and finally indium bump bonded to test chips fabricated by standard semiconductor lithography. This technology enables unprecedented via routing and packaging options for the 3D integration of microelectronic subsystems and focal plane arrays.

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Tobias Schaedler, Kayleigh A. Porter, Alex C. Yu, Erin S. Wernick, Souren Soukiazian, Trevor Sasse, Christina M. Seeholzer, Bor-An C. Tu, Courtney P. Wilt, Souheil Nadri, John A. Carlson, Jacob M. Hundley, Mark R. O'Masta, Binh-Minh Nguyen, and Peter D. Brewer "Micro-printing of ceramic packaging for sensor integration", Proc. SPIE PC12433, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVI, PC124330H (17 March 2023); https://doi.org/10.1117/12.2648588

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KEYWORDS

Ceramics

Packaging

Sensors

Additive manufacturing

Readout integrated circuits

Lithography

Microelectronics

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