Paper
14 June 1984 Wafer-Scale Laser Pantography: VI. Direct-Write Interconnection Of VLSI Gate Arrays
Bruce M McWilliams, Hon Wah Chin, Irving P Herman, Roderick A. Hyde, Fred Mitlitsky, John C. Whitehead, Lowell L. Wood
Author Affiliations +
Proceedings Volume 0459, Laser-Assisted Deposition, Etching, and Doping; (1984) https://doi.org/10.1117/12.939434
Event: 1984 Los Angeles Technical Symposium, 1984, Los Angeles, United States
Abstract
General principles of laser direct-write deposition processes are reviewed. Device interconnection of CMOS gate arrays by means of computer-controlled, laser-induced thermochemical surface reactions is described. Interconnection quality parameters are related, and processing rate considerations are discussed.
© (1984) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bruce M McWilliams, Hon Wah Chin, Irving P Herman, Roderick A. Hyde, Fred Mitlitsky, John C. Whitehead, and Lowell L. Wood "Wafer-Scale Laser Pantography: VI. Direct-Write Interconnection Of VLSI Gate Arrays", Proc. SPIE 0459, Laser-Assisted Deposition, Etching, and Doping, (14 June 1984); https://doi.org/10.1117/12.939434
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Cited by 13 scholarly publications.
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KEYWORDS
Tungsten

Silicon

Laser processing

Very large scale integration

Metals

Resistance

Chemical reactions

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