Cost-effective light-emission optical sub-assembly for datacenter networks

T. Suzuki; K. Adachi; K. R. Tamura; A. Nakanishi; K. Naoe; K. Nakahara; S. Tanaka

doi:10.1117/12.2249971

28 January 2017 Cost-effective light-emission optical sub-assembly for datacenter networks

T. Suzuki, K. Adachi, K. R. Tamura, A. Nakanishi, K. Naoe, K. Nakahara, S. Tanaka

Proceedings Volume 10131, Next-Generation Optical Networks for Data Centers and Short-Reach Links IV; 101310B (2017) https://doi.org/10.1117/12.2249971
Event: SPIE OPTO, 2017, San Francisco, California, United States

Abstract

Technologies for creating cost-effective light-emission optical sub-assemblies (OSAs) are discussed from the point of view of laser diodes. A lens-integrated surface-emitting laser (LISEL), consisting of a DFB laser, integrated mirror, and integrated convex lens, has the potential to achieve light-emission OSAs. An OSA based on the LISEL is proposed, and the capabilities of direct and passively aligned optical coupling, isolator-free operation, non-hermetic packaging, and on-wafer testing are introduced.

Citation Download Citation

T. Suzuki, K. Adachi, K. R. Tamura, A. Nakanishi, K. Naoe, K. Nakahara, and S. Tanaka "Cost-effective light-emission optical sub-assembly for datacenter networks", Proc. SPIE 10131, Next-Generation Optical Networks for Data Centers and Short-Reach Links IV, 101310B (28 January 2017); https://doi.org/10.1117/12.2249971

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