In this paper, a new approach named Contour-based 2D Metrology will be introduced as assistance for the repair processes of such challenging micro defects. Both CDSEM images of defect and reference are input for extracting; then contour-based patterns are overlapped for each other and compared with GDS as well, to describe quantitative differences for each micro area. Assisted with such rigorous and comprehensive data analysis, micro defects can be accurately positioned according to Aims Results and repair processes would be proceeding. |
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Photomasks
Metrology
Semiconducting wafers
Data analysis
Etching
Manufacturing
Visualization