Presentation + Paper
23 April 2020 Assessment of the quality of adhesive bond in t-joints coupons by using thermoelastic stress analysis
Rosa De Finis, Davide Palumbo, Umberto Galietti
Author Affiliations +
Abstract
Adhesively bonded joints represent an interesting alternative to mechanical joints due to the advantages over conventional mechanical fasteners: continuity of the structure, high strength-to-weight ratio, design flexibility. The aim of this work is to assess and predict the quality of aeronautical adhesive bonded CFRP T-joints made by the automated fibre placement process by means of the Thermoelastic Stress analysis (TSA) technique used as non-destructive technique. The results provided by TSA technique, in terms of debonded area, were compared to the well-established lock-in thermography technique showing the capability of TSA to evaluate the quality of T-joints. The approach allows to perform a cost-efficient characterisation process by means of non-destructive evaluations.
Conference Presentation
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Rosa De Finis, Davide Palumbo, and Umberto Galietti "Assessment of the quality of adhesive bond in t-joints coupons by using thermoelastic stress analysis", Proc. SPIE 11409, Thermosense: Thermal Infrared Applications XLII, 114090G (23 April 2020); https://doi.org/10.1117/12.2558607
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KEYWORDS
Adhesives

Thermography

Stress analysis

Skin

Nondestructive evaluation

Signal detection

Composites

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