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5 March 2021 Laser fabrication of high efficiency focusing diffractive optics for the THz range
Simonas Indrišiūnas, Evaldas Svirplys, Gediminas Račiukaitis, Linas Minkevičius, Andrzej Urbanowicz, Irmantas Kašalynas, Heiko Richter, Heinz-Wilhelm Hübers, Till Hagelschuer
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Proceedings Volume 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI; 1167316 (2021) https://doi.org/10.1117/12.2574616
Event: SPIE LASE, 2021, Online Only
Abstract
In this work transmission and reflection losses in silicon diffractive THz optical components fabricated by direct laser ablation are investigated. One of the possible sources of reflection/transmission losses in laser-fabricated optics is scattering due to the roughness of laser formed surface. Therefore, influence of laser processing parameters on the transmittance of laser processed silicon wafers was investigated in 0.1 –4.7 THz range. Transmittances of silicon samples ablated in ambient air and argon atmospheres were also compared. Using laser ablation technology MPFLs for 0.6 and 4.7 THz frequency radiation were fabricated and their performance was evaluated.
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Simonas Indrišiūnas, Evaldas Svirplys, Gediminas Račiukaitis, Linas Minkevičius, Andrzej Urbanowicz, Irmantas Kašalynas, Heiko Richter, Heinz-Wilhelm Hübers, and Till Hagelschuer "Laser fabrication of high efficiency focusing diffractive optics for the THz range", Proc. SPIE 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI, 1167316 (5 March 2021); https://doi.org/10.1117/12.2574616
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KEYWORDS
Terahertz radiation
Laser processing
Semiconductor lasers
Silicon
Simulation of CCA and DLA aggregates
Laser scattering
Laser ablation
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