Jack Baker,1 David G. Hayes,1 Tomas Peach,1 Sara Gillgrasshttps://orcid.org/0000-0003-2611-9168,1 Craig P. Allford,1 Curtis Hentschel,1 Angela Sobiesierski,1 Connie Eng,1 Saleem Shabbir,1 Stuart Thomas,1 Clive Meaton,1 Aidan Daly,2 Tracy Sweet,2 Iwan Davies,2 Samuel Shutts,1 Peter M. Smowton1,3
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Development of a quick fabrication (QF) method for commercial wafer characterisation based on rapid feedback of VCSEL performance. We report on the design of the fabrication process including the systematic removal of time-consuming steps of planarization, oxidation and substrate lapping, and the associated impact on device performance and yield. We show comparable performance of the oxide-confined QF etched trench VCSELs and full process devices and we show that unoxidised devices behave as large aperture oxidised devices. Further, we demonstrate similar performance of substrate-lapped and -unlapped VCSELs between 1.0-1.2 Ith with a difference in current tuning typically 0.064nm/mA.
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Jack Baker, David G. Hayes, Tomas Peach, Sara Gillgrass, Craig P. Allford, Curtis Hentschel, Angela Sobiesierski, Connie Eng, Saleem Shabbir, Stuart Thomas, Clive Meaton, Aidan Daly, Tracy Sweet, Iwan Davies, Samuel Shutts, Peter M. Smowton, "Quick fabrication of 940nm emitting VCSEL arrays for commercial wafer characterization," Proc. SPIE 11704, Vertical-Cavity Surface-Emitting Lasers XXV, 1170408 (5 March 2021); https://doi.org/10.1117/12.2578365