Presentation
5 March 2021 Quick fabrication of 940nm emitting VCSEL arrays for commercial wafer characterization
Author Affiliations +
Abstract
Development of a quick fabrication (QF) method for commercial wafer characterisation based on rapid feedback of VCSEL performance. We report on the design of the fabrication process including the systematic removal of time-consuming steps of planarization, oxidation and substrate lapping, and the associated impact on device performance and yield. We show comparable performance of the oxide-confined QF etched trench VCSELs and full process devices and we show that unoxidised devices behave as large aperture oxidised devices. Further, we demonstrate similar performance of substrate-lapped and -unlapped VCSELs between 1.0-1.2 Ith with a difference in current tuning typically 0.064nm/mA.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jack Baker, David G. Hayes, Tomas Peach, Sara Gillgrass, Craig P. Allford, Curtis Hentschel, Angela Sobiesierski, Connie Eng, Saleem Shabbir, Stuart Thomas, Clive Meaton, Aidan Daly, Tracy Sweet, Iwan Davies, Samuel Shutts, and Peter M. Smowton "Quick fabrication of 940nm emitting VCSEL arrays for commercial wafer characterization", Proc. SPIE 11704, Vertical-Cavity Surface-Emitting Lasers XXV, 1170408 (5 March 2021); https://doi.org/10.1117/12.2578365
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KEYWORDS
Vertical cavity surface emitting lasers

Semiconducting wafers

Calibration

Manufacturing

Thermal oxidation

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