Presentation + Paper
4 March 2022 High power conductively cooled laser diode array operating under hard pulse condition
Author Affiliations +
Abstract
We report the latest development of a high power conductively cooled laser module using a novel design approach. The laser bar is directly bonded to two heatsinks in a sandwich configuration without employing submounts as buffers for stress relief caused by CTE mismatch. Simulations were performed to aid the laser module design. The accuracy of the simulations was verified by experimental tests on the laser modules. Production data were collected and used to determine the key performance parameters, statistical distribution, lifetime, and failure mechanism. The laser module thermal rollover could reach 480W at 500A drive current under CW running mode. Furthermore, it could continuously operate under a harsh-hard pulse driving condition at 300A drive current with 300ms pulse width and 1Hz repetition rate.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
ChangXuan Li, Yingmin Fan, Wenwei Li, Ke Yuan, Tuanwei Fu, Jindou Liu, Chung-en Zah, and Chun He "High power conductively cooled laser diode array operating under hard pulse condition", Proc. SPIE 11982, Components and Packaging for Laser Systems VIII, 1198203 (4 March 2022); https://doi.org/10.1117/12.2609183
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KEYWORDS
Continuous wave operation

Heatsinks

Optical simulations

Packaging

High power lasers

Semiconductor lasers

Laser bonding

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