Paper
27 March 2022 640×512 back illuminated EMCCD
Qingfei Liu, Jianqiang Zhao, Shuxi Xu, Fang Dai, Jixue Chen, Wei Zhang, Yichen Duan
Author Affiliations +
Proceedings Volume 12169, Eighth Symposium on Novel Photoelectronic Detection Technology and Applications; 1216922 (2022) https://doi.org/10.1117/12.2622526
Event: Eighth Symposium on Novel Photoelectronic Detection Technology and Applications, 2021, Kunming, China
Abstract
640×512 back illuminated EMCCD is based on 640×512 front-face illuminated EMCCD. It is manufactured by wafer bonding, back thinning, laser annealing, film sputtering and other back illumination processes. After parameter test and imaging verification, 640×512 back illuminated EMCCD has the characteristics of high quantum efficiency, high detection sensitivity and anti-blooming, which is suitable for imaging in low illumination environment.
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Qingfei Liu, Jianqiang Zhao, Shuxi Xu, Fang Dai, Jixue Chen, Wei Zhang, and Yichen Duan "640×512 back illuminated EMCCD", Proc. SPIE 12169, Eighth Symposium on Novel Photoelectronic Detection Technology and Applications, 1216922 (27 March 2022); https://doi.org/10.1117/12.2622526
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Electron multiplying charge coupled devices

Back illuminated sensors

Semiconducting wafers

Quantum efficiency

Capacitance

Manufacturing

Wafer bonding

RELATED CONTENT

High transmission mask technology for 45nm node imaging
Proceedings of SPIE (March 15 2006)
High transmission mask technology for 45nm node imaging
Proceedings of SPIE (March 21 2006)
Lithography and design in partnership: a new roadmap
Proceedings of SPIE (October 17 2008)
Why bother with x-ray lithography?
Proceedings of SPIE (July 09 1992)

Back to Top