Inserting an embedding layer is an attractive solution to modulate the resistive switching performance of the memory according to the interfacial modulation effect. In this work, HfO2-based resistive random access memory is investigated with an ultrathin embedding Al2O3 layer. Three sets of memories were designed by embedding the ultrathin Al2O3 layer at different positions in the sandwich device, taking advantage of the large forbidden band width and low Gibbs free energy of the Al2O3. The ultrathin Al2O3 layer can modulate the energy band distribution, when inserted between HfO2 and ITO electrode, it functions to reduce the loss of oxygen ions, thereby limiting the region of oxygen vacancy conductive filament rupture. The results show that the Al/HfO2/Al2O3/ITO memory has a higher resistance switching ratio and more stable endurance characteristics. Consequently, the ultrathin embedding layer dominates the resistive switching mechanism which is critical to formation and rupture of conductive filaments, and significantly to improve the endurance and uniformity of the resistive state.
|