Open Access Paper
29 April 2024 Front Matter: Volume 12955
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 12955, including the Title Page, Copyright information, Table of Contents, and Conference Committee information.

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org.

The papers reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

Please use the following format to cite material from these proceedings:

Author(s), “Title of Paper,” in Metrology, Inspection, and Process Control XXXVIII, edited by Matthew J. Sendelbach, Nivea G. Schuch, Proc. of SPIE 12955, Seven-digit Article CID Number (DD/MM/YYYY); (DOI URL).

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510672161

ISBN: 9781510672178 (electronic)

Published by

SPIE

P.O. Box 10, Bellingham, Washington 98227-0010 USA

Telephone +1 360 676 3290 (Pacific Time)

SPIE.org

Copyright © 2024 Society of Photo-Optical Instrumentation Engineers (SPIE).

Copying of material in this book for internal or personal use, or for the internal or personal use of specific clients, beyond the fair use provisions granted by the U.S. Copyright Law is authorized by SPIE subject to payment of fees. To obtain permission to use and share articles in this volume, visit Copyright Clearance Center at copyright.com. Other copying for republication, resale, advertising or promotion, or any form of systematic or multiple reproduction of any material in this book is prohibited except with permission in writing from the publisher.

Printed in the United States of America by Curran Associates, Inc., under license from SPIE.

Publication of record for individual papers is online in the SPIE Digital Library.

00001_PSISDG12955_1295501_page_2_1.jpg

Paper Numbering: A unique citation identifier (CID) number is assigned to each article in the Proceedings of SPIE at the time of publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online and print versions of the publication. SPIE uses a seven-digit CID article numbering system structured as follows:

  • The first five digits correspond to the SPIE volume number.

  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.

Conference Committee

Symposium Chair

  • Qinghuang Lin, LinkTech International (United States)

Symposium Co-chair

  • John Robinson, KLA Corporation (United States)

Conference Chair

  • Matthew J. Sendelbach, TEL Technology Center, America, LLC (United States)

Conference Co-chair

  • Nivea G. Schuch, Applied Materials (France)

Conference Program Committee

  • Ofer Adan, Applied Materials Israel, Ltd. (Israel)

  • John A. Allgair, BRIDG (United States)

  • Masafumi Asano, Tokyo Electron Ltd. (Japan)

  • Bryan M. Barnes, National Institute of Standards and Technology (United States)

  • Cornel Bozdog, Onto Innovation Inc. (United States)

  • Benjamin D. Bunday, AMAG nanometro (United States)

  • Xiaomeng Chen, Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan)

  • Hugo Cramer, ASML Netherlands B.V. (Netherlands)

  • Timothy F. Crimmins, Intel Corporation (United States)

  • R. Joseph Kline, National Institute of Standards and Technology (United States)

  • Shunsuke Koshihara, Hitachi High-Technologies Corporation (Japan)

  • Yi-sha Ku, Industrial Technology Research Institute (Taiwan)

  • Byoung-Ho Lee, Hitachi High-Technologies Corporation (Japan)

  • Myungjun Lee, Samsung Electronics Company, Ltd. (Korea, Republic of)

  • Philippe Leray, imec (Belgium)

  • Narender Rana, KLA Corporation (United States)

  • Christopher J. Raymond, Onto Innovation Inc. (United States)

  • John C. Robinson, KLA Corporation (United States)

  • Daniel Schmidt, IBM Thomas J. Watson Research Center (United States)

  • Younghoon Sohn, Samsung Electronics Company, Ltd. (Korea, Republic of)

  • Alexander Starikov, I&I Consulting (United States)

  • Alok Vaid, GlobalFoundries (United States)

© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 12955", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 1295501 (29 April 2024); https://doi.org/10.1117/12.3031880
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Metrology

3D image processing

3D image enhancement

Overlay metrology

Scanning electron microscopy

3D optical data storage

Wafer bonding

Back to Top