Comprehensive EUV fab data management solution bridging reticle and wafer inspections

Alice Fu; Howard Lin; Calvin Hung; Bing-Rui Li; Ellis Lu; Jerry Hsieh; Brandon Hurt; Ryan Carlson; Xinya Liu; Masaki Satake; Derui Li; Will Wang; Wallace Wang; Brian Du; Daojing Li; Yao Zhang; Zeyu Lei; Narayani Narasimhan; Daniel Price; Vikram Tolani

doi:10.1117/12.3033686

12 November 2024 Comprehensive EUV fab data management solution bridging reticle and wafer inspections

Alice Fu, Howard Lin, Calvin Hung, Bing-Rui Li, Ellis Lu, Jerry Hsieh, Brandon Hurt, Ryan Carlson, Xinya Liu, Masaki Satake, Derui Li, Will Wang, Wallace Wang, Brian Du, Daojing Li, Yao Zhang, Zeyu Lei, Narayani Narasimhan, Daniel Price, Vikram Tolani

Author Affiliations +

Proceedings Volume 13215, International Conference on Extreme Ultraviolet Lithography 2024; 1321509 (2024) https://doi.org/10.1117/12.3033686
Event: SPIE Photomask Technology + EUV Lithography, 2024, Monterey, California, United States

Abstract

Mask defectivity remains a key focus area for the enablement of extreme ultraviolet (EUV) lithography in high-volume manufacturing (HVM) at both mask and IC manufacturing facilities. To improve defect detection on EUV patterns, both mask and wafer inspection tools are operated with high sensitivity and advanced algorithms, coupled with mask SEM and wafer e-beam review tools, all of which generate substantial amounts of data. This data must be thoroughly examined to identify any possible defect source information and improve the overall performance of mask outgoing, fab incoming, and requalification inspections. In this paper, the complete integration of a centralized reticle and wafer data management solution is presented, providing real-time analytics to help identify defect sources, monitor changes in defectivity due to exposure and reticle handling, and recognize systematic patterns of defectivity resulting from reticles used in an HVM flow. By combining reticle data from both the mask shop and requalification line with inline wafer inspection data, including wafer print checks, operators can make correct and timely go/no-go decisions for EUV reticles, minimizing any wafer impact, while engineering teams can obtain detailed information across reticle and wafer lots for defect reduction efforts. By integrating the mask-centric KlearView^™ Fab with the wafer-centric Klarity^® defect software systems, this comprehensive data management solution improves time to results, enhances the capability to trace defectivity to its source, and improves data continuity between mask and reticle manufacturing sites, thereby enabling EUV manufacturability and production yield.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Alice Fu, Howard Lin, Calvin Hung, Bing-Rui Li, Ellis Lu, Jerry Hsieh, Brandon Hurt, Ryan Carlson, Xinya Liu, Masaki Satake, Derui Li, Will Wang, Wallace Wang, Brian Du, Daojing Li, Yao Zhang, Zeyu Lei, Narayani Narasimhan, Daniel Price, and Vikram Tolani "Comprehensive EUV fab data management solution bridging reticle and wafer inspections", Proc. SPIE 13215, International Conference on Extreme Ultraviolet Lithography 2024, 1321509 (12 November 2024); https://doi.org/10.1117/12.3033686

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