Electronic speckle pattern interferometry for 3-D dynamic deformation analysis in industrial environments

Gerd Guelker; Olaf Haack; Klaus D. Hinsch; Claudia Hoelscher; Juergen Kuls; Winfried Platen

doi:10.1117/12.46821

1 October 1991 Electronic speckle pattern interferometry for 3-D dynamic deformation analysis in industrial environments

Gerd Guelker, Olaf Haack, Klaus D. Hinsch, Claudia Hoelscher, Juergen Kuls, Winfried Platen

Author Affiliations +

Proceedings Volume 1500, Innovative Optics and Phase Conjugate Optics; (1991) https://doi.org/10.1117/12.46821
Event: ECO4 (The Hague '91), 1991, The Hague, Netherlands

Abstract

Electronic speckle pattern interferometry (ESPI) is applied to 3-D deformation mapping in practical problems from constructional engineering. The shrinking behavior and bonding ability of repair mortars applied in the restoration of historical stone buildings is monitored. Strategies are illustrated to process the huge amount of deformation data toward parameters characteristic of the relevant processes. Thus, ESPI is extended to routine applications in industrial inspection.

Citation Download Citation

Gerd Guelker, Olaf Haack, Klaus D. Hinsch, Claudia Hoelscher, Juergen Kuls, and Winfried Platen "Electronic speckle pattern interferometry for 3-D dynamic deformation analysis in industrial environments", Proc. SPIE 1500, Innovative Optics and Phase Conjugate Optics, (1 October 1991); https://doi.org/10.1117/12.46821

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