Visual detection of defects in solder joints

V. B. Blaignan; Nikolaos G. Bourbakis; Ali Moghaddamzadeh; Evangelos A. Yfantis

doi:10.1117/12.205516

27 March 1995 Visual detection of defects in solder joints

V. B. Blaignan, Nikolaos G. Bourbakis, Ali Moghaddamzadeh, Evangelos A. Yfantis

Proceedings Volume 2423, Machine Vision Applications in Industrial Inspection III; (1995) https://doi.org/10.1117/12.205516
Event: IS&T/SPIE's Symposium on Electronic Imaging: Science and Technology, 1995, San Jose, CA, United States

Abstract

The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

Citation Download Citation

V. B. Blaignan, Nikolaos G. Bourbakis, Ali Moghaddamzadeh, and Evangelos A. Yfantis "Visual detection of defects in solder joints", Proc. SPIE 2423, Machine Vision Applications in Industrial Inspection III, (27 March 1995); https://doi.org/10.1117/12.205516

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