Overlay Characterization Of Projection Aligners Using Electrical Probe Techniques

C. P. Ausschnitt; T. A. Brunner; S. C. Yang

doi:10.1117/12.933681

15 October 1982 Overlay Characterization Of Projection Aligners Using Electrical Probe Techniques

C. P. Ausschnitt, T. A. Brunner, S. C. Yang

Proceedings Volume 0342, Integrated Circuit Metrology I; (1982) https://doi.org/10.1117/12.933681
Event: 1982 Technical Symposium East, 1982, Arlington, United States

Abstract

We describe an approach to overlay measurement based upon well-known electrical probe techniques. The advantages realized by our approach are process simplicity, measurement precision of ±0.01μm, independence from imagery and process variations, site-by-site accuracy verification, and the capability of performing many successive overlay evaluations on a single reference wafer. We present the results of overlay performance evaluations of state-of-the-art 1:1 projection printers, including alignment and distortion components and the variable magnification capability.

Citation Download Citation

C. P. Ausschnitt, T. A. Brunner, and S. C. Yang "Overlay Characterization Of Projection Aligners Using Electrical Probe Techniques", Proc. SPIE 0342, Integrated Circuit Metrology I, (15 October 1982); https://doi.org/10.1117/12.933681

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available