Chemical imaging of microvias in flip chip pin grid array packages using time-of-flight secondary ion mass spectroscopy

Yoon Loong Khong; Hooi Ling Lee

doi:10.1117/12.404875

23 October 2000 Chemical imaging of microvias in flip chip pin grid array packages using time-of-flight secondary ion mass spectroscopy

Yoon Loong Khong, Hooi Ling Lee

Author Affiliations +

Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000) https://doi.org/10.1117/12.404875
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore

Abstract

Distribution of chemical species in cross sectioned micro- via were observed using the Time-of-Flight-Secondary-Ion- Mass-Spectroscopy (TOF-SIMS). The TOF-SIMS combines high molecular and elemental detection sensitivities and good lateral resolution for detection of molecular and elemental content in the micro-via and surrounding structures of the flip-chip-pin-grid array packages fabricated from several sources. The data obtained indicate that it is feasible to compare and monitor organic package fabrication processes using TOF-SIMS chemical images.

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Yoon Loong Khong and Hooi Ling Lee "Chemical imaging of microvias in flip chip pin grid array packages using time-of-flight secondary ion mass spectroscopy", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); https://doi.org/10.1117/12.404875

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