Paper
5 June 2001 Integrated applications of inspection data in the semiconductor manufacturing environment
Author Affiliations +
Abstract
As integrated circuit fabrication processes continue to increase in complexity, it has been determined that data collection, retention, and retrieval rates will continue to increase at an alarming rate. At future technology nodes, the time required to source manufacturing problems must at least remain constant to maintain anticipated productivity as suggested in the International Technology Roadmap for Semiconductors. Strategies and software methods for integrated yield management have been identified as critical for maintaining this productivity. Integrated yield management must use circuit design, visible defect, parametric, and functional test data to recognize process trends and excursions so that yield-detracting mechanisms can be rapidly identified and corrected. This will require the intelligent merging of the various data sources that are collected and maintained throughout the fabrication environment.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kenneth W. Tobin Jr., Thomas P. Karnowski, and Fred Lakhani "Integrated applications of inspection data in the semiconductor manufacturing environment", Proc. SPIE 4275, Metrology-based Control for Micro-Manufacturing, (5 June 2001); https://doi.org/10.1117/12.429361
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CITATIONS
Cited by 21 scholarly publications.
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KEYWORDS
Manufacturing

Semiconducting wafers

Semiconductors

Image processing

Databases

Inspection

Image retrieval

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