Module/packaging technologies for optical components: current and future trends

Masahiro Kobayashi; Achyut Kumar Dutta

doi:10.1117/12.436020

30 July 2001 Module/packaging technologies for optical components: current and future trends

Masahiro Kobayashi, Achyut Kumar Dutta

Proceedings Volume 4532, Active and Passive Optical Components for WDM Communication; (2001) https://doi.org/10.1117/12.436020
Event: ITCom 2001: International Symposium on the Convergence of IT and Communications, 2001, Denver, CO, United States

Abstract

The basic design methodology and criteria required for packaging of optical components are reviewed, and the state-of-art of different types of the packaging technologies of laser modules and receiver modules are addressed. They are Mini-DIL DFB-LD module, wavelength-locker integrated laser module, 10 Gbps receiver module with integrated APD and preamplifier IC, and non-hermetic SMT module. Considerations on future packaging technologies and integrated optical components are also discussed.

Citation Download Citation

Masahiro Kobayashi and Achyut Kumar Dutta "Module/packaging technologies for optical components: current and future trends", Proc. SPIE 4532, Active and Passive Optical Components for WDM Communication, (30 July 2001); https://doi.org/10.1117/12.436020

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