Parameter evaluation of photoresist coating model by using orthogonal experiment and regression analysis

Ren-Jyh Leu; Yu-Pen Fun; Hung-Chih Chen; Kun-I Lee; Hsiang-Chung Liu

doi:10.1117/12.445735

16 October 2001 Parameter evaluation of photoresist coating model by using orthogonal experiment and regression analysis

Ren-Jyh Leu, Yu-Pen Fun, Hung-Chih Chen, Kun-I Lee, Hsiang-Chung Liu

Author Affiliations +

Proceedings Volume 4602, Semiconductor Optoelectronic Device Manufacturing and Applications; (2001) https://doi.org/10.1117/12.445735
Event: International Symposium on Optoelectonics and Microelectronics, 2001, Nanjing, China

Abstract

In this paper, we want to optimize photo-resist coating recipe by using orthogonal experiment and statistical regression analysis. We combined two major factors influenced coating performance -- 'wafer coating time' & 'wafer spinning speed' in TRACK unit with IDI^TM pump dispense recipe. Eventually, IDI^TM pump dispense recipe contained of four steps dispense time and dispense pressure. By using orthogonal experiment and statistical regression method we obtained set of process parameters which have good predicted performance values. Based on those data, we could apply it on different viscosity type resist to get good coating performance as decreasing resist dispense volume from 3 cc/pcs to 1.6 cc/pcs. Results showed the performance of CD (Critical Dimension) and CP (Chip Probe) yield was comparable to original 3 cc/pcs coating recipe condition. Actually, we could optimize coating recipe to reach resist usage decreasing purpose.

Citation Download Citation

Ren-Jyh Leu, Yu-Pen Fun, Hung-Chih Chen, Kun-I Lee, and Hsiang-Chung Liu "Parameter evaluation of photoresist coating model by using orthogonal experiment and regression analysis", Proc. SPIE 4602, Semiconductor Optoelectronic Device Manufacturing and Applications, (16 October 2001); https://doi.org/10.1117/12.445735

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