Investigation of interfacial behavior of a Si-epoxy-FR4 structure under thermal testing using moiré interferometry

Zhao Wei Zhong; K. W. Wong; X. Q. Shi; Z. P. Wang

doi:10.1117/12.468423

25 March 2003 Investigation of interfacial behavior of a Si-epoxy-FR4 structure under thermal testing using moire interferometry

Zhao Wei Zhong, K. W. Wong, X. Q. Shi, Z. P. Wang

Author Affiliations +

Proceedings Volume 4945, MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly; (2003) https://doi.org/10.1117/12.468423
Event: Photonics Fabrication Europe, 2002, Bruges, Belgium

Abstract

The interfacial behavior of a flip chip structure under thermal testing was investigated using real-time moire interferometry. The maximum shear strain occurred at the silicon-epoxy interface. The shear strain variation increased significantly along the interface, with the maximum shear concentration occurring at the edge of the specimen. The creep effect was more dominant in the FR4-epoxy interface. To characterize the behavior of the interfacial crack, stress intensity factors and the strain energy release rate in the vicinity of the crack tip were used to conduct a qualitative study. A sharp strain gradient occurred at the crack tip. The stress intensity factors were dependent on temperature.

Citation Download Citation

Zhao Wei Zhong, K. W. Wong, X. Q. Shi, and Z. P. Wang "Investigation of interfacial behavior of a Si-epoxy-FR4 structure under thermal testing using moire interferometry", Proc. SPIE 4945, MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly, (25 March 2003); https://doi.org/10.1117/12.468423

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