Integration of active optical components

Torsten Wipiejewski; Yuliya A. Akulova; Gregory A. Fish; Clint L. Schow; Ping Koh; Adil Karim; Shigeru Nakagawa; Anders Dahl; Peter Kozodoy; Alex Matson; Bradley W. Short; Chuck M. Turner; Steven Penniman; Michael C. Larson; Christopher W. Coldren; Larry A. Coldren

doi:10.1117/12.475470

30 May 2003 Integration of active optical components

Torsten Wipiejewski, Yuliya A. Akulova, Gregory A. Fish, Clint L. Schow, Ping Koh, Adil Karim, Shigeru Nakagawa, Anders Dahl, Peter Kozodoy, Alex Matson, Bradley W. Short, Chuck M. Turner, Steven Penniman, Michael C. Larson, Christopher W. Coldren, Larry A. Coldren

Author Affiliations +

Proceedings Volume 4997, Photonics Packaging and Integration III; (2003) https://doi.org/10.1117/12.475470
Event: Integrated Optoelectronics Devices, 2003, San Jose, CA, United States

Abstract

Integration of active optical components typically serves five goals: enhanced performance, smaller space, lower power dissipation, higher reliability, and lower cost. We are manufacturing widely tunable laser diodes with an integrated high speed electro absorption modulator for metro and all-optical switching applications. The monolithic integration combines the functions of high power laser light generation, wavelength tuning over the entire C-band, and high speed signal modulation in a single chip. The laser section of the chip contains two sampled grating DBRs with a gain and a phase section between them. The emission wavelength is tuned by current injection into the waveguide layers of the DBR and phase sections. The laser light passes through an integrated optical amplifier before reaching the modulator section on the chip. The amplifier boosts the cw output power of the laser and provides a convenient way of power leveling. The modulator is based on the Franz-Keldysh effect for a wide band of operation. The common waveguide through all sections minimizes optical coupling losses. The packaging of the monolithically integrated chip is much simpler compared to a discrete or hybrid solution using a laser chip, an SOA, and an external modulator. Since only one optical fiber coupling is required, the overall packaging cost of the transmitter module is largely reduced. Error free transmission at 2.5Gbit/s over 200km of standard single mode fiber is obtained with less than 1dB of dispersion penalty.

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Torsten Wipiejewski, Yuliya A. Akulova, Gregory A. Fish, Clint L. Schow, Ping Koh, Adil Karim, Shigeru Nakagawa, Anders Dahl, Peter Kozodoy, Alex Matson, Bradley W. Short, Chuck M. Turner, Steven Penniman, Michael C. Larson, Christopher W. Coldren, and Larry A. Coldren "Integration of active optical components", Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003); https://doi.org/10.1117/12.475470

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