Characterization and modeling of intradie variation and its applications to design for manufacturability

Sharad Saxena; Carlo Guardiani; Michele Quarantelli; Nicola Dragone; Sean Minehane; Patrick McNamara; Jeff A. Babcock

doi:10.1117/12.497477

10 July 2003 Characterization and modeling of intradie variation and its applications to design for manufacturability

Sharad Saxena, Carlo Guardiani, Michele Quarantelli, Nicola Dragone, Sean Minehane, Patrick McNamara, Jeff A. Babcock

Proceedings Volume 5042, Design and Process Integration for Microelectronic Manufacturing; (2003) https://doi.org/10.1117/12.497477
Event: Advanced Microelectronic Manufacturing, 2003, Santa Clara, CA, United States

Abstract

Device scaling increases the impact of within-die variation or mismatch on the performance and yield of many important components of System on Chip (SoC) designs. This has created a need for accurate characterization, modeling, and simulation of mismatch. This paper provides a brief overview of the recent progress in these areas along with an example illustrating the application of these techniques to Design for Manufacturability (DFM) of Ultra Deep Submicron (UDSM) technologies.

Citation Download Citation

Sharad Saxena, Carlo Guardiani, Michele Quarantelli, Nicola Dragone, Sean Minehane, Patrick McNamara, and Jeff A. Babcock "Characterization and modeling of intradie variation and its applications to design for manufacturability", Proc. SPIE 5042, Design and Process Integration for Microelectronic Manufacturing, (10 July 2003); https://doi.org/10.1117/12.497477

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