Using OPC to optimize for image slope and improve process window

Nicolas B. Cobb; Yuri Granik

doi:10.1117/12.504379

28 August 2003 Using OPC to optimize for image slope and improve process window

Nicolas B. Cobb, Yuri Granik

Proceedings Volume 5130, Photomask and Next-Generation Lithography Mask Technology X; (2003) https://doi.org/10.1117/12.504379
Event: Photomask and Next Generation Lithography Mask Technology X, 2003, Yokohama, Japan

Abstract

We use the gradient of the image slope and gradient of the edge placement error (EPE) in order to improve both slope and EPE during OPC. The EPE gradient taken with respect to edge position is normally called MEEF or the MEEF matrix. Use of the gradient of image slope with respect to change in edge position was introduced by Granik as the “contrast matrix.” Whereas traditional OPC techniques focus on EPE alone (pattern fidelity), we broaden the scope of OPC to maximize slope for improved image robustness and to maximize process window.

Citation Download Citation

Nicolas B. Cobb and Yuri Granik "Using OPC to optimize for image slope and improve process window", Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); https://doi.org/10.1117/12.504379

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available