AC-coupled interconnect for high-density high-bandwidth packaging

Paul D Franzon; Stephen Mick; John M. Wilson; Lei Luo; Karthik Chandrasakhar

doi:10.1117/12.528076

30 March 2004 AC-coupled interconnect for high-density high-bandwidth packaging

Paul D Franzon, Stephen Mick, John M. Wilson, Lei Luo, Karthik Chandrasakhar

Proceedings Volume 5274, Microelectronics: Design, Technology, and Packaging; (2004) https://doi.org/10.1117/12.528076
Event: Microelectronics, MEMS, and Nanotechnology, 2003, Perth, Australia

Abstract

AC Coupled Interconnection (ACCI), in conjunction with buried solder bump technology, provides a method to achieve signal I/O pitches of less than 100 μm and signaling rates greater than 3 Gbps per I/O on integrated circuits, while preserving excellent signal integrity. This paper presents a summary of approaches and status capacitive and inductive versions of AC Coupled Interconnect Systems.

Citation Download Citation

Paul D Franzon, Stephen Mick, John M. Wilson, Lei Luo, and Karthik Chandrasakhar "AC-coupled interconnect for high-density high-bandwidth packaging", Proc. SPIE 5274, Microelectronics: Design, Technology, and Packaging, (30 March 2004); https://doi.org/10.1117/12.528076

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