Paper
15 July 2004 Short and ultrashort laser pulses: an upcoming tool for processing optical and semiconductor materials
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Abstract
Laser beam sources emitting pulses with durations in the regime between nano- and femtoseconds are winning more and more importance for processing optical and semiconductor materials. Beneath lithography, etching and coating, laser technology is necessary to support the production of innovative electronic and optical devices. Finest structures, cuts and drillings can be manufactured in a high variety of materials like silicon, glasses but also in composite materials like polymers. In this paper a survey on a number of laser based processes for microelectronic and optoelectronic manufacturing is presented. With regard to this context effects and material interactions are discussed and attached to different laser beam sources. The quality of processes as well as their economical meaning from perspective of laser technology is evaluated. An overview about machining and actual trends for ns-, upcoming ps- and fs-laser technology are presented.
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Christian J. Kulik "Short and ultrashort laser pulses: an upcoming tool for processing optical and semiconductor materials", Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); https://doi.org/10.1117/12.541437
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Cited by 4 scholarly publications.
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KEYWORDS
Laser ablation

Silicon

Laser cutting

Laser processing

Absorption

Semiconductor lasers

Pulsed laser operation

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