Application of computer tomography in microelectronic packaging

Martina Speck; Klaus-Jurgen Wolter; Dietmar Daniel; Marek Danczak

doi:10.1117/12.540848

21 July 2004 Application of computer tomography in microelectronic packaging

Martina Speck, Klaus-Jurgen Wolter, Dietmar Daniel, Marek Danczak

Proceedings Volume 5392, Testing, Reliability, and Application of Micro- and Nano-Material Systems II; (2004) https://doi.org/10.1117/12.540848
Event: NDE for Health Monitoring and Diagnostics, 2004, San Diego, CA, United States

Abstract

In nondestructive testing (NDT) of microelectronic components many applications using X-ray radiography are well established. This method is based on the attenuation of radiation intensities of x-rays transmitting an object. Computer tomography (CT), however, is a visualization method which is based on reconstructing three-dimensional models from several two-dimensional X-ray projections of the object. It is only recently used for NDT because it is more expensive and time consuming than conventional X-ray imaging. Nevertheless, there are applications where simple radiography provides only poor results because of superimposed object layers. This article discusses NDT specific problems of CT such as beam hardening and shows some microelectronic applications benefiting from CT as well as examples where modifications of the standard CT procedure are necessary to gain depth information about the object. This so called limited angle tomography reaches a higher image resolution than CT when flat modules are tested.

Citation Download Citation

Martina Speck, Klaus-Jurgen Wolter, Dietmar Daniel, and Marek Danczak "Application of computer tomography in microelectronic packaging", Proc. SPIE 5392, Testing, Reliability, and Application of Micro- and Nano-Material Systems II, (21 July 2004); https://doi.org/10.1117/12.540848

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