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12 April 2005 Femtosecond versus picosecond laser ablation (Keynote Address)
Andreas Ostendorf, Guenter Kamlage, Ulrich Klug, Frank Korte, Boris N. Chichkov
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Proceedings Volume 5713, Photon Processing in Microelectronics and Photonics IV; (2005) https://doi.org/10.1117/12.597975
Event: Lasers and Applications in Science and Engineering, 2005, San Jose, California, United States
Abstract
Results of ablation of different materials by femtosecond and picosecond laser pulses are compared. Advantages and disadvantages of both laser systems are discussed. Two most important criteria, processing speed and quality of the fabricated structures, are addressed. High repetition rate picosecond lasers allow high speed cutting of thin metal foils and silicon wafers, whereas for micro-drilling it is more advantageous to use femtosecond laser systems.
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Andreas Ostendorf, Guenter Kamlage, Ulrich Klug, Frank Korte, and Boris N. Chichkov "Femtosecond versus picosecond laser ablation (Keynote Address)", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); https://doi.org/10.1117/12.597975
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KEYWORDS
Picosecond phenomena
Femtosecond phenomena
Laser systems engineering
Laser drilling
Laser cutting
Semiconducting wafers
Semiconductor lasers
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