Infrared Imaging For Thermal Analysis Of Quality Control And Reliability Problems

R. Paulson; J. Barney; R. F. Leftwich; R. Friedman

doi:10.1117/12.954390

20 October 1975 Infrared Imaging For Thermal Analysis Of Quality Control And Reliability Problems

R. Paulson, J. Barney, R. F. Leftwich, R. Friedman

Proceedings Volume 0060, Solving Quality Control and Reliability Problems with Optics; (1975) https://doi.org/10.1117/12.954390
Event: Solving Quality Control and Reliability Problems with Optics, 1975, San Diego, United States

Abstract

Infrared imaging devices can be used to view thermal characteristics in real time and to solve a wide variety of problems. An infrared microscanner originally introduced at SPIE in 1972 is shown applied to produce infrared signatures of beam lead devices . A number of other applications using other scanning techniques are also presented, including the examination of heat pipes, coatings, hybrid circuits and coils. Methods of using these thermal images in solving quality control and reliability problems are discussed.

Citation Download Citation

R. Paulson, J. Barney, R. F. Leftwich, and R. Friedman "Infrared Imaging For Thermal Analysis Of Quality Control And Reliability Problems", Proc. SPIE 0060, Solving Quality Control and Reliability Problems with Optics, (20 October 1975); https://doi.org/10.1117/12.954390

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