Integrated microsystems packaging approach with LCP

Paul Jaynes; Lawrence W. Shacklette

doi:10.1117/12.665505

18 May 2006 Integrated microsystems packaging approach with LCP

Paul Jaynes, Lawrence W. Shacklette

Proceedings Volume 6232, Intelligent Integrated Microsystems; 62320M (2006) https://doi.org/10.1117/12.665505
Event: Defense and Security Symposium, 2006, Orlando (Kissimmee), Florida, United States

Abstract

Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

Citation Download Citation

Paul Jaynes and Lawrence W. Shacklette "Integrated microsystems packaging approach with LCP", Proc. SPIE 6232, Intelligent Integrated Microsystems, 62320M (18 May 2006); https://doi.org/10.1117/12.665505

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