Thermal effects of moisture inducing delamination in light-emitting diode packages

Jianzheng Hu; Lianqiao Yang; Moo Whan Shin

doi:10.1117/12.691555

28 September 2006 Thermal effects of moisture inducing delamination in light-emitting diode packages

Jianzheng Hu, Lianqiao Yang, Moo Whan Shin

Proceedings Volume 6355, Advanced LEDs for Solid State Lighting; 635516 (2006) https://doi.org/10.1117/12.691555
Event: Asia-Pacific Optical Communications, 2006, Gwangju, South Korea

Abstract

This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.

Citation Download Citation

Jianzheng Hu, Lianqiao Yang, and Moo Whan Shin "Thermal effects of moisture inducing delamination in light-emitting diode packages", Proc. SPIE 6355, Advanced LEDs for Solid State Lighting, 635516 (28 September 2006); https://doi.org/10.1117/12.691555

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