Microfabrication of all-polymer capacitors for electronics

Shuping Wang; Bradley W. Borden; Richard Li

doi:10.1117/12.782457

19 November 2007 Microfabrication of all-polymer capacitors for electronics

Shuping Wang, Bradley W. Borden, Richard Li

Proceedings Volume 6724, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; 672406 (2007) https://doi.org/10.1117/12.782457
Event: 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Large Mirrors and Telescopes, 2007, Chengdu, China

Abstract

All-polymer capacitors are fabricated using the laser direct pattering combined with a novel lifting procedure. This parallel plate capacitor is achieved by using a highly doped silicon wafer and poly(3,4-ethylenedioxythiophene) as the electrodes and Norland Optical Adhesive 61 as the dielectric material. The resulting polymeric capacitor is characterized and analyzed for suitability in electronic circuits. The method offers an attractive processing technique as it does not require high temperatures, the need of a vacuum environment, or masks, providing a low cost prototyping with quick turn around time in the design and realization of capacitors that have applications in all polymer IC technology.

Citation Download Citation

Shuping Wang, Bradley W. Borden, and Richard Li "Microfabrication of all-polymer capacitors for electronics", Proc. SPIE 6724, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 672406 (19 November 2007); https://doi.org/10.1117/12.782457

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