Numerical analysis of cutting glass by dual CO2- laser beams

Junke Jiao; Xinbing Wang; Xueling Zhang; Wenlong Tang; Fujun Liu; Yanzhao Lu

doi:10.1117/12.753774

4 January 2008 Numerical analysis of cutting glass by dual CO₂-laser beams

Junke Jiao, Xinbing Wang, Xueling Zhang, Wenlong Tang, Fujun Liu, Yanzhao Lu

Proceedings Volume 6825, Lasers in Material Processing and Manufacturing III; 68250G (2008) https://doi.org/10.1117/12.753774
Event: Photonics Asia 2007, 2007, Beijing, China

Abstract

Cutting brittle materials such as ceramics and glass by lasers or traditional saw method, costly fractures and associated damage such as chips and cracks can result. In most cases, these problems were caused as a result of the stress was not controlled properly and exceeded the critical value of the fracture. In this study, a dual-laser-beam method was proposed to avoid fractures in glass laser cutting, where an off-focused CO₂-laser beam was scanning on the top surface of glass periodically and repeatedly and a preheated-band which has a proper temperature was built. This preheated-band will reduce the temperature gradients when the glass is cut by the focused CO₂-laser beam. Under these conditions, glass can be cut with melting method without any fractures. The process of cutting glass by dual CO₂-laser beams was simulated numerically with FEA method and the distribution of temperature and thermal stress was investigated. The relationships between the cutting parameters, such as laser beam diameter, laser power, cutting speed, and the profile of the cutting groove were also discussed. The result showed that thermal stress decreased with the increasing width of preheated-banding, and the smaller the diameter of laser beam, the better the quality of the cutting groove was in the same laser power situation.

Citation Download Citation

Junke Jiao, Xinbing Wang, Xueling Zhang, Wenlong Tang, Fujun Liu, and Yanzhao Lu "Numerical analysis of cutting glass by dual CO₂-laser beams", Proc. SPIE 6825, Lasers in Material Processing and Manufacturing III, 68250G (4 January 2008); https://doi.org/10.1117/12.753774

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