3.125 Gbps multichannel electrical transmission line design for CWDM

Teck Guan Lim D.V.M.; Yee Mong Khoo; Jing Li; Yi Yoon Chai; Chee Wei Tan; Pamidighantam V. Ramana; John Hon Shing Lau; Seiji Maruo

doi:10.1117/12.764151

8 February 2008 3.125 Gbps multichannel electrical transmission line design for CWDM

Teck Guan Lim D.V.M., Yee Mong Khoo, Jing Li, Yi Yoon Chai, Chee Wei Tan, Pamidighantam V. Ramana, John Hon Shing Lau, Seiji Maruo

Author Affiliations +

Proceedings Volume 6899, Photonics Packaging, Integration, and Interconnects VIII; 68990O (2008) https://doi.org/10.1117/12.764151
Event: Integrated Optoelectronic Devices 2008, 2008, San Jose, California, United States

Abstract

Silicon Optical Bench (SiOB) is a popular solution for passive assembly of optical module. In order to realize an optical transmitter or receiver module, it is necessary to integrate high frequency optoelectronic components such as signal photodiodes (PD) or laser diodes (LD) onto the SiOB. In this way, the module's electrical and optical performances can be further improved, and a higher degree of miniaturization can be achieved. The challenge for this integration is not only on the assembly accuracy for the LD and PD, it required the design of low loss electrical interconnect at high frequency. However, the standard silicon substrate used in the SiOB has a high electrical loss especially at high frequency. This imposed a limitation on the electrical interconnection length between the optoelectronic components and their I/O interfaces. It is proposed here to design the electrical interconnection using a layer of SiO₂ sandwiched between two layers of metal layer. Simulations have demonstrated that by varying the thickness of the SiO₂ layer, an optimum electrical performance can be achieved.

Citation Download Citation

Teck Guan Lim D.V.M., Yee Mong Khoo, Jing Li, Yi Yoon Chai, Chee Wei Tan, Pamidighantam V. Ramana, John Hon Shing Lau, and Seiji Maruo "3.125 Gbps multichannel electrical transmission line design for CWDM", Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 68990O (8 February 2008); https://doi.org/10.1117/12.764151

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