Paper
27 January 2009 High-speed sequential image acquisition using a CMOS image sensor with a multi-lens optical system and its application for three-dimensional measurement
Daisuke Miyazaki, Hiroki Shimizu, Yoshizumi Nakao, Takashi Toyoda, Yasuo Masaki
Author Affiliations +
Proceedings Volume 7249, Sensors, Cameras, and Systems for Industrial/Scientific Applications X; 72490T (2009) https://doi.org/10.1117/12.807189
Event: IS&T/SPIE Electronic Imaging, 2009, San Jose, California, United States
Abstract
A novel technique for acquiring time-sequential images during a frame-capture period of an ordinary CMOS image sensor using a multi-lens optical system is proposed. In addition, this system is utilized for high-speed three-dimensional measurement based on a spatial encoding method. In the proposed image capturing system, multiple lenses are rhomboidally arranged on a CMOS image sensor to detect multiple images for one object. Because pixel values in the CMOS image sensor are obtained sequentially, we can obtain multiple images that are captured at different timing. In the spatial encoding method, several kinds of optical patterns are projected to a measured object. It is possible to obtain multiple images in which different patterns are projected to the object within one frame period by dividing the captured images and reconstruct images from rearrange the parts of image. The principle of the proposed method was verified by three-dimensional measurement with a CMOS compound-eye image capturing. The size of the three-dimensional image was 360 x 270 pixel, and the number of steps of distance was 64, and the measurement time was 1/15 seconds.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Daisuke Miyazaki, Hiroki Shimizu, Yoshizumi Nakao, Takashi Toyoda, and Yasuo Masaki "High-speed sequential image acquisition using a CMOS image sensor with a multi-lens optical system and its application for three-dimensional measurement", Proc. SPIE 7249, Sensors, Cameras, and Systems for Industrial/Scientific Applications X, 72490T (27 January 2009); https://doi.org/10.1117/12.807189
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Cited by 2 scholarly publications.
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KEYWORDS
Image sensors

CMOS sensors

3D metrology

Imaging systems

3D image processing

3D acquisition

Cameras

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