Paper
24 August 2009 Multi-physics multi-scale modeling issues in LED
Sheng Liu, Zhiyin Gan, Xiaobing Luo, Kai Wang, Xiaohui Song, Zhaohui Chen, Han Yan, Zongyuan Liu, Pei Wang, Wei Wei
Author Affiliations +
Proceedings Volume 7375, ICEM 2008: International Conference on Experimental Mechanics 2008; 737507 (2009) https://doi.org/10.1117/12.839005
Event: International Conference on Experimental Mechanics 2008 and Seventh Asian Conference on Experimental Mechanics, 2008, Nanjing, China
Abstract
Multi-physics multi-scale modeling issues in various stages of the LED manufacturing such as MOCVD reactor design, epitaxial growth based on silicon wafer, chip design and manufacturing, module packaging and assembly have been discussed, which are critical to LED fabrication. In order to enhance the LED design and fabrication efficiency, we propose a new concept to integrate multi-physics/multi-scale modeling as a simulation platform to assist LED design and fabrication. It is indicated that the simulation that relies on multi-physics/multi-scale modeling has the potential to significantly reduce development costs and optimize the fabrication processes of LED
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sheng Liu, Zhiyin Gan, Xiaobing Luo, Kai Wang, Xiaohui Song, Zhaohui Chen, Han Yan, Zongyuan Liu, Pei Wang, and Wei Wei "Multi-physics multi-scale modeling issues in LED", Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 737507 (24 August 2009); https://doi.org/10.1117/12.839005
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Cited by 2 scholarly publications.
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KEYWORDS
Light emitting diodes

Gallium nitride

Packaging

Manufacturing

Finite element methods

Silicon

3D modeling

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