Paper
11 February 2010 Generic packaging concepts in the frame of network of excellence ePIXnet
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Abstract
Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tolga Tekin, Lars Zimmermann, Henning Schröder, Pieter Dumon, Wim Bogaerts, Jose Vicente Galan, Pablo Sanchis, William Whelan-Curtin, and Daryl Beggs "Generic packaging concepts in the frame of network of excellence ePIXnet", Proc. SPIE 7604, Integrated Optics: Devices, Materials, and Technologies XIV, 76040I (11 February 2010); https://doi.org/10.1117/12.842999
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KEYWORDS
Packaging

Silicon photonics

Photonics

Waveguides

Tolerancing

Silicon

Fiber couplers

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