Paper
2 April 2010 Stat-LRC: statistical rules check for variational lithography
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Abstract
As interconnect densities increase with each technology generation, the lithographic processes required to print all features with acceptable irregularities have become more complex. Restricted design rules (RDR) and modelbased Design for Manufacturability (DFM) guidelines have been added to the existing Design Rule Check (DRC) software to prevent unprintable patterns to be drawn on the mask by predicting their imprint on the wafer. It is evident from analyses of predicted patterns that edge placement errors have a continuous distribution, hence a pass/fail cut-off is somewhat arbitrary. In this paper, we describe a methodology to perform Statistical Lithography Rules Check (Stat-LRC) involving design yield based on interconnect linewidth distribution for variation in lithographic input error sources. In this scheme, a list of error locations indicating polygons that have yield below a user specified threshold are listed. The overall design yield is recovered by trading-off slightly poorer EPE distributions for lines with short runs with excellent ones. The simulation/analysis environment is fully automated and yield recovery improvement has been demonstrated.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Aswin Sreedhar and Sandip Kundu "Stat-LRC: statistical rules check for variational lithography", Proc. SPIE 7641, Design for Manufacturability through Design-Process Integration IV, 76410P (2 April 2010); https://doi.org/10.1117/12.846606
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KEYWORDS
Photomasks

Lithography

Metals

Line width roughness

Error analysis

Image segmentation

Monte Carlo methods

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