InGaAs detector arrays hermetic encapsulation technology

Qinfei Xu; Dafu Liu

doi:10.1117/12.870098

17 November 2010 InGaAs detector arrays hermetic encapsulation technology

Qinfei Xu, Dafu Liu

Proceedings Volume 7847, Optoelectronic Devices and Integration III; 78472H (2010) https://doi.org/10.1117/12.870098
Event: Photonics Asia 2010, 2010, Beijing, China

Abstract

In this paper, 256×1 and 512×1 element linear InGaAs detector arrays are hermetic packaged. Some processes were studied, including the structure design, thermoelectric cooler (TEC) heat load performance test, TEC vacuum baking, the window sealing, the seam welding of the cover lid and shell, and so on. The results show that the cooling temperature difference of TEC can reach over 55 K at room temperature, and it decreases by about 0.51 K with each additional 50 mW heat load. TEC works well after 500 hours of baking at 120 °C. The leakage rate tests show the assembly is better than 10^-5 Pa.cm3/s.

Citation Download Citation

Qinfei Xu and Dafu Liu "InGaAs detector arrays hermetic encapsulation technology", Proc. SPIE 7847, Optoelectronic Devices and Integration III, 78472H (17 November 2010); https://doi.org/10.1117/12.870098

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