Thermal Characteristics Of Bonded Structure Analysis Using Holography And Infrared Thermography

Yuwen Wang; Yushan Tan; C. H. Ku

doi:10.1117/12.941722

17 February 1987 Thermal Characteristics Of Bonded Structure Analysis Using Holography And Infrared Thermography

Yuwen Wang, Yushan Tan, C. H. Ku

Proceedings Volume 0814, Photomechanics and Speckle Metrology; (1987) https://doi.org/10.1117/12.941722
Event: 31st Annual Technical Symposium on Optical and Optoelectronic Applied Sciences and Engineering, 1987, San Diego, CA, United States

Abstract

A technique for the fabrication of machine tool structures by epoxy resin bonding has been developed. The design principles and technical factors are discussed from tests of bonded joints. A model fabrication of a lathe spindle box was designed and manufactured. Infrared thermography was used to monitor and calculate the surface temperature distributions of the above structure. And the holographic quantitative analysis of three dimansional displacements was used to measure and calculate the thermal deformation. In this paper the advanced measuring techniques and real-time data of thermal characteristics of the above structure is presented.

Citation Download Citation

Yuwen Wang, Yushan Tan, and C. H. Ku "Thermal Characteristics Of Bonded Structure Analysis Using Holography And Infrared Thermography", Proc. SPIE 0814, Photomechanics and Speckle Metrology, (17 February 1987); https://doi.org/10.1117/12.941722

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