The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon. Please use the following format to cite material from this book: Author(s), “Title of Paper,” in Alternative Lithographic Technologies VI, edited by Douglas J. Resnick, Christopher Bencher, Proceedings of SPIE Vol. 9049 (SPIE, Bellingham, WA, 2014) Article CID Number. ISSN: 0277-786X ISBN: 9780819499721 Published by SPIE P.O. Box 10, Bellingham, Washington 98227-0010 USA Telephone +1 360 676 3290 (Pacific Time) · Fax +1 360 647 1445 SPIE.org Copyright © 2014, Society of Photo-Optical Instrumentation Engineers. Copying of material in this book for internal or personal use, or for the internal or personal use of specific clients, beyond the fair use provisions granted by the U.S. Copyright Law is authorized by SPIE subject to payment of copying fees. The Transactional Reporting Service base fee for this volume is $18.00 per article (or portion thereof), which should be paid directly to the Copyright Clearance Center (CCC), 222 Rosewood Drive, Danvers, MA 01923. Payment may also be made electronically through CCC Online at copyright.com. Other copying for republication, resale, advertising or promotion, or any form of systematic or multiple reproduction of any material in this book is prohibited except with permission in writing from the publisher. The CCC fee code is 0277-786X/14/$18.00. Printed in the United States of America. Publication of record for individual papers is online in the SPIE Digital Library.
Paper Numbering: Proceedings of SPIE follow an e-First publication model, with papers published first online and then in print and on CD-ROM. Papers are published as they are submitted and meet publication criteria. A unique, consistent, permanent citation identifier (CID) number is assigned to each article at the time of the first publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online, print, and electronic versions of the publication. SPIE uses a six-digit CID article numbering system in which:
■ The first four digits correspond to the SPIE volume number. ■ The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc.
The CID Number appears on each page of the manuscript. The complete citation is used on the first page, and an abbreviated version on subsequent pages. Numbers in the index correspond to the last two digits of the six-digit CID Number. Conference Committee Symposium Chair Symposium Co-chair Conference Chair Conference Co-chair Conference Program Committee Frank E. Abboud, Intel Corporation (United States) Kenneth R. Carter, University of Massachusetts Amherst (United States) Joy Y. Cheng, IBM Almaden Research Center (United States) Juan J. de Pablo, The University of Chicago (United States) Elizabeth A. Dobisz, HGST (United States) Michael A. Guillorn, IBM Thomas J. Watson Research Center (United States) Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan) Daniel J. C. Herr, The University of North Carolina at Greensboro (United States) Tatsuhiko Higashiki, Toshiba Corporation (Japan) James A. Liddle, National Institute of Standards and Technology (United States) Shy-Jay Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan) Hans Loeschner, IMS Nanofabrication AG (Austria) John G. Maltabes, Hewlett-Packard Laboratories (United States) Laurent Pain, CEA-LETI (France) Ivo W. Rangelow, Technische Universität Ilmenau (Germany) Benjamen M. Rathsack, Tokyo Electron America, Inc. (United States) Ricardo Ruiz, HGST (United States) Frank M. Schellenberg, Consultant (United States) Helmut Schift, Paul Scherrer Institut (Switzerland) Ines A. Stolberg, Vistec Electron Beam Lithography Group (Germany) William M. Tong, KLA-Tencor Corporation (United States) Kevin T. Turner, University of Pennsylvania (United States) Marco J. Wieland, MAPPER Lithography (Netherlands) Wei Wu, The University of Southern California (United States)
Session Chairs 1 Alternative Lithography Keynote Session Douglas J. Resnick, Molecular Imprints, Inc. (United States) Christopher Bencher, Applied Materials, Inc. (United States) 2 DSA Process and Integration Joy Y. Cheng, IBM Almaden Research Center (United States) Lei Wen, HGST (United States) 3 Novel Nanolithography Ivo W. Rangelow, Technische Universität Ilmenau (Germany) Helmut Schift, Paul Scherrer Institut (Switzerland) 4 Roll to Roll UV Nanoimprint Lithography John G. Maltabes, Hewlett-Packard Laboratories (United States) Laurent Pain, CEA-LETI (France) 5 Metrology and Inspection for Directed Self-Assembly: Joint Session with Conferences 9049 and 9050 Martha I. Sanchez, IBM Research-Almaden (United States) Daniel J. C. Herr, The University of North Carolina at Greensboro (United States) 6 Beam Lithography James A. Liddle, National Institute of Standards and Technology (United States) Ines A. Stolberg, Vistec Electron Beam GmbH (Germany) 7 DSA Materials and Processes I: Joint Session with Conferences 9049 and 9051 Benjamen M. Rathsack, Tokyo Electron America, Inc. (United States) Roel Gronheid, IMEC (Belgium) 8 DSA Materials and Processes II: Joint Session with 9049 and 9051 James A. Liddle, National Institute of Standards and Technology (United States) Ralph R. Dammel, AZ Electronic Materials USA Corp. (United States) 9 Step and Repeat UV Nanoimprint Lithography Tatsuhiko Higashiki, Toshiba Corporation (Japan) Naoya Hayashi, Dai Nippon Printing Company, Ltd. (Japan) 10 Multiple Electron Beam Direct Write Lithography Hans Loeschner, IMS Nanofabrication AG (Austria) Frank E. Abboud, Intel Corporation (United States) 11 DSA Line Patterning Frank M. Schellenberg, Consultant (United States) 12 Nanodevice Fabrication Kevin T. Turner, University of Pennsylvania (United States) 13 DSA Design for Manufacturability: Joint Session with Conferences 9049, 9052, and 9053 Michael A. Guillorn, IBM Thomas J. Watson Research Center (United States) Bruce W. Smith, Rochester Institute of Technology (United States) 14 DSA Via Patterning Ricardo Ruiz, HGST (United States) Shy-Jay Lin, Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan)
|
