Paper
22 September 2014 Scanning removal of ion-implanted novolak resist by using a laser irradiation
Tomosumi Kamimura, Yuta Kuroki, Takuya Kiriyama, Hiroki Muraoka, Takashi Nishiyama, Yoshiyuki Harada, Hiroyuki Kuramae, Hideo Horibe
Author Affiliations +
Abstract
Novolak resists which are implanted with B, P, and As ions, respectively, were irradiated with a pulsed 532nm laser. Regardless of the implanted ion species and density, more than 74 % of the laser power was found to absorb into the Si wafer surface. For the laser irradiation of 1 pulse, the ion-implanted resist with a density of 5.0x1013 atoms/cm2 was completely stripped in the same way as that of a non-implanted resist. The optical absorption of the resist surface increased as the density of the ion-implantation increased. In case of the ion-implanted resist with a density of 5.0x1015 atoms/cm2, the resist was stripped by 20 pulses irradiation without occurring laser-induced surface damage. A scanning removal of the highly ion-implanted resist was also successfully stripped by using an optimized irradiation condition. A highly ion-implanted resist was continuously stripped by the scanning laser irradiation with 20 pulses.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tomosumi Kamimura, Yuta Kuroki, Takuya Kiriyama, Hiroki Muraoka, Takashi Nishiyama, Yoshiyuki Harada, Hiroyuki Kuramae, and Hideo Horibe "Scanning removal of ion-implanted novolak resist by using a laser irradiation", Proc. SPIE 9238, Pacific Rim Laser Damage 2014: Optical Materials for High-Power Lasers, 92380J (22 September 2014); https://doi.org/10.1117/12.2073477
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Silicon

Semiconducting wafers

Laser irradiation

Ions

Laser induced damage

Wafer-level optics

Absorbance

Back to Top