Microwave Interconnects Via Electromagnetic Coupling

John J. Burke; Robert W. Jackson

doi:10.1117/12.947449

8 September 1988 Microwave Interconnects Via Electromagnetic Coupling

John J. Burke, Robert W. Jackson

Proceedings Volume 0947, Interconnection of High Speed and High Frequency Devices and Systems; (1988) https://doi.org/10.1117/12.947449
Event: Advances in Semiconductors and Superconductors: Physics and Device Applications, 1988, Newport Beach, CA, United States

Abstract

Two transitions are described which couple coplanar waveguide on one substrate surface (a motherboard) to either coplanar waveguide or microstrip on another substrate surface (a chip). No wire bonds are necessary. A coupled transmission line model, along with a full wave analysis, is used to predict the behavior of these transitions. Experimental results show good agreement with predictions in cases where the coupler length to width ratio is not too small.

Citation Download Citation

John J. Burke and Robert W. Jackson "Microwave Interconnects Via Electromagnetic Coupling", Proc. SPIE 0947, Interconnection of High Speed and High Frequency Devices and Systems, (8 September 1988); https://doi.org/10.1117/12.947449

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