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1 April 2022 Versatile fully reflective beam splitter for high throughput manufacturing with high power green femtosecond laser
Gwenn Pallier, Mathieu Dijoux, Ivan Gusachenko, Sebastien Estival, Paul Etienne Martin, Pu Jian, Guillaume Labroille
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Proceedings Volume PC11988, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVII; PC119880D (2022) https://doi.org/10.1117/12.2614754
Event: SPIE LASE, 2022, San Francisco, California, United States
Abstract
Laser microprocessing using Ultra-Short Pulse lasers has developed thanks to the achieved process quality. The main challenge of those processes is the yield improvement. This study will focus on yield improvement of applications such as such as probe card manufacturing for electronic applications with a green USP laser using beam splitting. We present here a fully reflective beam splitter compatible with 500fs green lasers. The compatibility with an industrial machine is demonstrated through a F-theta lens, as well as through a precession head. We show here the process results including the repeatability of the pattern, and the achievable ablation rate.
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Gwenn Pallier, Mathieu Dijoux, Ivan Gusachenko, Sebastien Estival, Paul Etienne Martin, Pu Jian, and Guillaume Labroille "Versatile fully reflective beam splitter for high throughput manufacturing with high power green femtosecond laser", Proc. SPIE PC11988, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVII, PC119880D (1 April 2022); https://doi.org/10.1117/12.2614754
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KEYWORDS
Beam splitters
Femtosecond phenomena
Manufacturing
Reflectivity
High power lasers
Laser development
Materials processing
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