Aleksandra Marković, Mathis Lefebvre, Laurent Mazenq, Samuel Charlot, Marc Gély, Aurélie Lecestre, Mathieu Arribat, Guillaume Jourdan, Bernard Legrand
Journal of Optical Microsystems, Vol. 4, Issue 03, 033501, (September 2024) https://doi.org/10.1117/1.JOM.4.3.033501
TOPICS: Silicon, Etching, Atomic force microscopy, Oxides, Semiconducting wafers, Fabrication, Plasma etching, Resonators, Lithography, Microresonators
Raising the mechanical frequency of atomic force microscopy (AFM) probes to increase the measurement bandwidth has been a long-standing expectation in the field and a technically difficult challenge. Recent advances in cavity optomechanics and in-plane probe designs have yielded significant progress. In situations in which an AFM tip extends a few micrometers from a planar optomechanical resonator, we present an approach to make it overhang from the probe die with precise control of the edge-line position. This fabrication step, which exposes the tip apex to the sample surface, is a prerequisite for any AFM experiment with optomechanical probes. We utilize a combination of saw dicing and time-controlled isotropic plasma etching to undercut the 725-μm-thick silicon substrate beneath the tip. The technique is easy to implement without any lithography steps. The overhang length of the tip is controlled to less than 5 μm with very good smoothness of the edge, reproducibility, and yield.