Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects

Ikechi A. Ukaegbu; Jamshid Sangirov; Mu Hee Cho; Tae-Woo Lee; Hyo-Hoon Park

doi:10.1117/1.3600768

1 July 2011 Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects

Ikechi A. Ukaegbu, Jamshid Sangirov, Mu Hee Cho, Tae-Woo Lee, Hyo-Hoon Park

Author Affiliations +

Optical Engineering, Vol. 50, Issue 7, 075401 (July 2011). https://doi.org/10.1117/1.3600768

Abstract

In this paper, a crosstalk expression and equivalent circuit model have been proposed based on RLC line model and interconnect parameters for wire-bonded and flip-chip bonded multichannel optoelectronic modules. The analytical expression and model are accurate for computing crosstalk of interconnects used in chip packaging. In addition, full-wave simulation and experimental results from total crosstalk measurement are discussed.

©(2011) Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation Download Citation

Ikechi A. Ukaegbu, Jamshid Sangirov, Mu Hee Cho, Tae-Woo Lee, and Hyo-Hoon Park "Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects," Optical Engineering 50(7), 075401 (1 July 2011). https://doi.org/10.1117/1.3600768

Published: 1 July 2011

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