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Ander Hormaetxe
Mechanical Engineer at Institut de Ciències de l'Espai
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Author
Publications (3)
Proceedings Article | 31 August 2022 Poster + Paper
The detector/readout-electronics assembly of the eXTP wide field monitor
F. Zwart, R. Tacken, J. J. in't Zand, R. de la Rie, M. Limpens, C. Kochanowski, G. Aitink-Kroes, C. van Baren, J. Bayer, D. Baudin, F. Ceraudo, Y. Evangelista, M. Feroci, M. Frericks, J.-L. Gálvez, O. Gevin, M. Hernanz, A. Hormaetxe, P. Laubert, A. Meuris, J. Nab, J. Neelis, C. Tenzer, C. Vogel, G. Zampa
Proceedings Volume 12181, 1218167 (2022) https://doi.org/10.1117/12.2629406
KEYWORDS: Sensors, Electronics, Cameras, Adhesives, Silicon, Hybrid circuits, Spatial resolution, Manufacturing, Electrons, Temperature metrology
Proceedings Article | 31 August 2022 Presentation + Paper
The wide field monitor onboard the Chinese-European x-ray mission eXTP
Margarita Hernanz, Søren Brandt, Jean in't Zand, Yuri Evangelista, Aline Meuris, Chris Tenzer, Gianluigi Zampa, Piotr Orleanski, Emrah Kalemci, Müberra Sungur, Stéphane Schanne, Frans Zwart, Rob de la Rie, Phillip Laubert, Coen van Baren, Gabby Aitink-Kroes, Lucien Kuiper, Jörg Bayer, Paul Hedderman, Samuel Pliego, Hao Xiong, Riccardo Campana, Ettore Del Monte, Marco Feroci, Francesco Ceraudo, Olivier Gevin, Irfan Kuvvetli, Denis Tcherniak, Konrad Skup, Malgorzata Michalska, Witold Nowosielski, Ander Hormaetxe, José-Luis Gálvez, Patrícia Ferrés, Alessandro Patruno, Walter Bonvicini, Matias Antonelli, Mirko Boezio, Daniela Cirrincione, Riccardo Munini, Alexandre Rachevski, Andrea Vacchi, Nicola Zampa, Irina Rashevskaya, Andrea Argan, Onur Turhan, Ayhan Bozkurt, Ahmet Onat, Enrico Bozzo, Andrea Santangelo, Shuang-Nan Zhang, Fangjun Lu, Yupeng Xu
Proceedings Volume 12181, 121811Y (2022) https://doi.org/10.1117/12.2628335
KEYWORDS: Cameras, Sensors, X-rays, Spatial resolution, Space operations, Image resolution, Stars, Observatories, X-ray imaging, Silicon
Proceedings Article | 31 August 2022 Poster + Paper
The mechanical design and implementation of the WFM cameras for eXTP
J.-L. Gálvez, A. Hormaetxe, M. Hernanz, P. Ferrés, G. Taubmann, J.-M. Casalta, A. Tomàs
Proceedings Volume 12181, 1218165 (2022) https://doi.org/10.1117/12.2628637
KEYWORDS: Sensors, Cameras, Digital signal processing, Collimators, Manufacturing, X-rays, Tungsten, Mechanical engineering, Optical alignment, Tolerancing
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