Mr. Bernhard R. Liegl Profile

Bernhard R. Liegl

Engineer at GLOBALFOUNDRIES Inc

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Author

Publications (10)

SPIE Journal Paper | 1 October 2010

Predicting substrate-induced focus error

Bernhard Liegl, Brian Sapp, Stephen Greco, Timothy Brunner, Nelson Felix, Ian Stobert, Kourosh Nafisi, Chandra Sarma

JM3, Vol. 9, Issue 04, 041311, (October 2010) https://doi.org/10.1117/12.10.1117/1.3530580

KEYWORDS: Semiconducting wafers, Scatterometry, Image processing, Scanners, Error analysis, Scatter measurement, Silicon, Metrology, Sensors, Lithography

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Proceedings Article | 2 April 2010 Paper

Application of automated topography focus corrections for volume manufacturing

Timothy Wiltshire, Bernhard Liegl, Emily Hwang, Mark Lucksinger

Proceedings Volume 7638, 76380F (2010) https://doi.org/10.1117/12.846652

KEYWORDS: Lithography, Metals, Wafer-level optics, Semiconducting wafers, Optical calibration, Semiconductors, Manufacturing, Data corrections, Optics manufacturing, Logic

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Proceedings Article | 4 March 2010 Paper

Predicting and reducing substrate induced focus error

Bernhard Liegl, Brian Sapp, Kia Low, Stephen Greco, Timothy Brunner, Nelson Felix, Ian Stobert, Kourosh Nafisi, Chandrasekhar Sarma

Proceedings Volume 7640, 76400Z (2010) https://doi.org/10.1117/12.846768

KEYWORDS: Semiconducting wafers, Scanners, Image processing, Sensors, Calibration, Imaging systems, Scatterometry, Silicon, Scatter measurement, Wafer-level optics

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Proceedings Article | 4 March 2010 Paper

The GridMapper challenge: how to integrate into manufacturing for reduced overlay error

Allen Gabor, Bernhard Liegl, Michael Pike, Emily Hwang, Timothy Wiltshire

Proceedings Volume 7640, 764015 (2010) https://doi.org/10.1117/12.849225

KEYWORDS: Overlay metrology, Semiconducting wafers, Scanners, Manufacturing, Reticles, Lithography, Optics manufacturing, Laser scanners, 3D scanning, Software development

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Proceedings Article | 7 March 2008 Paper

Measuring layer-specific depth-of-focus requirements

Bernhard Liegl, Allen Gabor, Colin Brodsky, John Cotte, Mahadevaiyer Krishnan

Proceedings Volume 6924, 69244J (2008) https://doi.org/10.1117/12.773382

KEYWORDS: Semiconducting wafers, Sensors, Calibration, Optical lithography, Error analysis, Imaging systems, Image resolution, Metals, Interferometry, Wafer-level optics

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Proceedings Article | 7 March 2008 Paper

Determining DOF requirements needed to meet technology process assumptions

Allen Gabor, Andrew Brendler, Bernhard Liegl, Colin Brodsky, Gerhard Lembach, Scott Mansfield, Shailendra Mishra, Timothy Brunner, Timothy Wiltshire, Vinayan Menon, Wai-kin Li

Proceedings Volume 6924, 69241L (2008) https://doi.org/10.1117/12.773070

KEYWORDS: Critical dimension metrology, Tolerancing, Lithography, Photomasks, Scanners, Semiconducting wafers, Electroluminescence, Optical lithography, Error analysis, Reactive ion etching

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Proceedings Article | 26 March 2007 Paper

Topography induced defocus with a scanning exposure system

Bernhard Liegl, Nelson Felix, Colin Brodsky, David Dobuzinsky

Proceedings Volume 6520, 65203J (2007) https://doi.org/10.1117/12.712420

KEYWORDS: Semiconducting wafers, Metrology, Wafer testing, Image processing, Imaging systems, Optical lithography, Pulsed laser operation, Spatial resolution, Microelectronics, Chemical engineering

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Proceedings Article | 30 July 2002 Paper

Is model-based optical proximity correction ready for manufacturing? Study on 0.12- and 0.175-um DRAM technology

Yuping Cui, Franz Zach, Shahid Butt, Wai-Kin Li, Bernhard Liegl, Lars Liebmann

Proceedings Volume 4691, (2002) https://doi.org/10.1117/12.474618

KEYWORDS: Optical proximity correction, Model-based design, Photomasks, Semiconducting wafers, Error analysis, Data modeling, Computer aided design, Lithography, Optics manufacturing, Photoresist processing

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Proceedings Article | 22 August 2001 Paper

Optimization of segmented alignment marks for advanced semidonductor fabrication processes

Qiang Wu, Zhijian Lu, Gary Williams, Franz Zach, Bernhard Liegl

Proceedings Volume 4344, (2001) https://doi.org/10.1117/12.436746

KEYWORDS: Optical alignment, Image segmentation, Silicon, Scattering, Light scattering, Metals, Lithography, Computer simulations, Semiconductors, Tolerancing

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Proceedings Article | 5 July 2000 Paper

Lithography process cost considerations for 120-nm groundrules

Bernhard Liegl, Christian Summerer

Proceedings Volume 4000, (2000) https://doi.org/10.1117/12.388932

KEYWORDS: Semiconducting wafers, Photomasks, Lithography, Phase shifts, Thin films, Reticles, Resolution enhancement technologies, Thin film coatings, Etching, Logic

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Showing 5 of 10 publications

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