Mr. Chang-Il Oh Profile

Chang-Il Oh

Senior Member/Technical Staff at SK Hynix Inc

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Publications (8)

Proceedings Article | 17 April 2014 Paper

Comparison of EUV patterning performance between PTD and NTD for 1Xnm DRAM

Changil Oh, Hyungsuk Seo, Eunjoo Park, Junghyung Lee, Cheolkyu Bok, Wontaik Kwon, Sungki Park

Proceedings Volume 9048, 904808 (2014) https://doi.org/10.1117/12.2046624

KEYWORDS: Extreme ultraviolet, Optical lithography, Nanoimprint lithography, Photoresist processing, Semiconducting wafers, Line width roughness, Double patterning technology, Extreme ultraviolet lithography, Absorption, Lithography

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Proceedings Article | 20 March 2012 Paper

Characteristics analysis of RELACS process from an OPC point of view

Jinyoung Choi, Minae Yoo, Chanha Park, Changil Oh, Cheolkyun Kim, Hyunjo Yang, Donggyu Yim

Proceedings Volume 8325, 83251Z (2012) https://doi.org/10.1117/12.916121

KEYWORDS: Optical proximity correction, Image processing, Lithography, Semiconducting wafers, Photoresist processing, Standards development, Reticles, Resolution enhancement technologies, Scanning electron microscopy, Lithographic illumination

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There are strong demands for techniques which are able to extend application of ArF immersion lithography. Especially, the leading edge techniques are required to make very small hole patterns below 50nm. Several techniques such as double patterning technique, free-form illumination and resist shrinkage technology are considered as viable candidates. Most of all, NTD (Negative Tone Development) is being regarded as the most promising technology for the realization of small hole patterns When NTD process is applied, hole patterns are defined by island type features on the reticle and consequently its optical performance shows better result compared with PTD (Positive Tone Development) process. However it is still difficult to define extremely small hole patterns below 40nm, new combination process of NTD with RELACS is being introduced to overcome resolution limitation. NTD combined with RELACS, which is the most advanced lithography technology, definitely enable us to generate smaller size hole patterns on the wafer. A chemical shrinkage technology, RELACS (Resolution Enhancement Lithography Assisted by Chemical Shrink), utilizes the cross linking reaction catalyzed by the acid component existing in a predefined resist pattern. In case of PTD combined with RELACS process, we already know that CD change after the shrinkage process is not influenced by duty ratio. So we could easily reflect the RELACS bias to meet the CD target during OPC (Optical Proximity Correction) procedure. But NTD combined with RELACS process was not understood clearly, nor verified. It requires more investigation of physical behavior during combined process in order to define exact hole patterns. The newly introduced process might require additive OPC modeling procedure to satisfy target CD when NTD RELACS bias has different values according to pitch and shape. This study is going to include the investigation on two types of resist shrinkage process, PTD and NTD. The optimized OPC methodology will be discussed through the evaluation on simple array hole patterns and random hole patterns.

Proceedings Article | 16 April 2011 Paper

Defect printability analysis in negative tone development lithography

Junggun Heo, Changil Oh, Junghyung Lee, Minkyung Park, Hyungsuk Seo, Cheolkyu Bok, Donggyu Yim, Sungki Park

Proceedings Volume 7972, 79721K (2011) https://doi.org/10.1117/12.871048

KEYWORDS: Optical lithography, Lithography, Etching, Photomasks, Image processing, Semiconducting wafers, Image enhancement, Photoresist processing, Electroluminescence, Resistance

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Proceedings Article | 26 March 2010 Paper

Topcoat-less resist process for 2Xnm node devices

Changil Oh, Junghyung Lee, Junggun Heo, Hyunkyung Shim, Keundo Ban, Cheolkyu Bok, Donggyu Yim, Sungki Park

Proceedings Volume 7639, 76393A (2010) https://doi.org/10.1117/12.846707

KEYWORDS: Photoresist processing, Line width roughness, Immersion lithography, Scanners, Optical lithography, Bridges, Semiconducting wafers, Etching, Photomasks, Materials processing

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Proceedings Article | 18 March 2009 Paper

EUV-patterning characterization using a 3D mask simulation and field EUV scanner

Jun-Taek Park, Yoon-Suk Hyun, Chang-Moon Lim, Tae-Seung Eom, Sunyoung Koo, Sarohan Park, Suk-Kyun Kim, Keun-Do Ban, Hyun-Jo Yang, Chang-Il Oh, Byung-Ho Nam, Chang-Reol Kim, HyeongSoo Kim, Seung-Chan Moon, Sungki Park

Proceedings Volume 7271, 72711G (2009) https://doi.org/10.1117/12.814407

KEYWORDS: Photomasks, Extreme ultraviolet lithography, Scanners, Critical dimension metrology, Extreme ultraviolet, Silicon, Optical lithography, Deep ultraviolet, Semiconducting wafers, Laser scanners

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Proceedings Article | 26 March 2008 Paper

Novel spin-on organic hardmask with high plasma etch resistance

Chang-Il Oh, Jin-Kuk Lee, Min-Soo Kim, Kyong-Ho Yoon, Hwan-Sung Cheon, Nataliya Tokareva, Jee-Yun Song, Jong-Seob Kim, Tu-Won Chang

Proceedings Volume 6923, 69232V (2008) https://doi.org/10.1117/12.771758

KEYWORDS: Etching, Resistance, Plasma etching, Carbon, Polymers, Plasma, Chemical species, Lithography, Dry etching, Chemical vapor deposition

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Proceedings Article | 2 April 2007 Paper

Spin-on Organic Hardmask Materials in 70nm Devices

Chang-Il Oh, Dong-Seon Uh, Do-Hyeon Kim, Jin-Kuk Lee, Hui-Chan Yun, Irina Nam, Min-Soo Kim, Kyong-Ho Yoon, Kyung-Hee Hyung, Nataliya Tokareva, Hwan-Sung Cheon, Jong-Seob Kim, Tu-Won Chang

Proceedings Volume 6519, 65192R (2007) https://doi.org/10.1117/12.711720

KEYWORDS: Etching, Photoresist processing, Polymers, Lithography, Silicon, Semiconducting wafers, Reflectivity, Carbon, Particles, Plasma

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Proceedings Article | 24 July 2002 Paper

Development of bottom antireflective coating for high-resolution KrF lithography

Yoon-Ho Kang, Chang-Il Oh, Sung Song, Deog-Bae Kim, Jae-Hyun Kim

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474185

KEYWORDS: Etching, Lithography, Reflectivity, Refractive index, Polymers, Photoresist processing, Chromophores, Bottom antireflective coatings, Polymer thin films, Photorefractive polymers

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Showing 5 of 8 publications

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