Addressing EUV masks registration challenges through closed loop correction
Avi Cohen1, Ofir Sharoni1, Dirk Beyer2, Christian Ehrlich2
1Carl Zeiss SMS Ltd. Karmiel , Hadolev 3, 20156 Bar Lev Industrial Park, Israel
2Carl Zeiss SMT GmbH, Carl-Zeiss-Promenade 10, 07745 Jena, Germany
ABSTRACT
EUV lithography is expected to become a critical enabling technology in the short and mid future of high end IC manufacturing. Although much effort is going into process and manufacturing challenges and inroads are being made in the industry, some process residuals will still exist with the move to HVM and among them will be the mask registration errors and the on product overlay (OPO).
The PROVE® system is the state of the art high end registration metrology tool capable of measuring both DUV as well as EUV masks. The ForTune® EUV utilizes an ultra short pulse laser to modify the mask substrate in order to correct registration errors and bring the mask into specification. Combining the metrology capabilities of the PROVE® with the corrective capabilities of the ForTune® EUV allows a closed loop solution in which the registration metrology data is utilized to feed forward the correction job needed to be applied over the mask in the ForTune® EUV.
This paper investigates the ability to improve mask registration on EUV masks using closed loop feedback between the PROVE® and ForTune® systems. Initial registration data from an EUV mask is measured by the PROVE® and utilized to both calculate the mask tuning job as well as predict the improvement prior to actual procession. After carrying out the registration correction on the ForTune® EUV, the EUV mask is again measured on the PROVE® to evaluate the ForTune® EUV process
The registration is measured with the PROVE® and the data is utilized by the Advanced Tuning Center, a FAVOR® solution, to prepare the job for the ForTune® EUV correction.
KEYWORDS: EUV, ForTune®, PROVE®, EUV mask, overlay correction, registration correction,
For defect disposition and repair verification regarding printability, AIMS™ is the state of the art measurement tool in industry. With its unique capability of capturing aerial images of photomasks it is the one method that comes closest to emulating the printing behaviour of a scanner. However for nanoimprint lithography (NIL) templates aerial images cannot be applied to evaluate the success of a repair process. Hence, for NIL defect dispositioning scanning, electron microscopy (SEM) imaging is the method of choice. In addition, it has been a standard imaging method for further root cause analysis of defects and defect review on optical photomasks which enables 2D or even 3D mask profiling at high resolutions. In recent years a trend observed in mask shops has been the automation of processes that traditionally were driven by operators. This of course has brought many advantages one of which is freeing cost intensive labour from conducting repetitive and tedious work. Furthermore, it reduces variability in processes due to different operator skill and experience levels which at the end contributes to eliminating the human factor. Taking these factors into consideration, one of the software based solutions available under the FAVOR® brand to support customer needs is the aerial image evaluation software, AIMS™ AutoAnalysis (AAA). It provides fully automated analysis of AIMS™ images and runs in parallel to measurements. This is enabled by its direct connection and communication with the AIMS™tools. As one of many positive outcomes, generating automated result reports is facilitated, standardizing the mask manufacturing workflow. Today, AAA has been successfully introduced into production at multiple customers and is supporting the workflow as described above. These trends indeed have triggered the demand for similar automation with respect to SEM measurements leading to the development of SEM AutoAnalysis (SAA). It aims towards a fully automated SEM image evaluation process utilizing a completely different algorithm due to the different nature of SEM images and aerial images. Both AAA and SAA are the building blocks towards an image evaluation suite in the mask shop industry.
With the continuing decrease of feature sizes on photomasks and the related rising costs for current and future masks
the importance of a reliable repair and repair assessment process has often been highlighted. The assessment, repair and
repair validation of these expensive masks has become a very substantial factor of the total mask production cost
The introduction of immersion lithography and the proposed introduction of double exposure strategies will further
amplify this trend. In this paper we have concentrated on masks with feature sizes relevant for the 45nm node and
defects with typical size and shape as they appear in production. Phase shifting masks with synthetic defects have been
manufactured and the printability of the defects is analyzed with an AIMSTM45-193i. For representative defects the
outline and three-dimensional shape as well as further characteristics have been visualized with the inherent electron
microscope capability of the electron beam based repair tool, prior to repairing them with the repair system. In addition
we will show the behaviour of the phase of the mask in a region of interest, that is in this case the repair area and its
immediate vicinity. This will be done by a special new tool, named Phame(R), developed for measuring the actual phase
of smallest mask features with a high spatial resolution.
The decreasing feature sizes as induced by the ITRS have a growing impact on the cost of current and future
photolithographic masks. The assessment, repair and repair validation of these expensive masks has become a very
substantial factor of the total mask production cost. The introduction of immersion lithography and the proposed
introduction of double exposure strategies will further amplify this trend. In order to make the whole procedure more
manageable in a production environment, with its constraints on timing and resource allocation, a seamless workflow of
the repair and validation procedure is sought. A proposed way to achieve this is the set up of a dedicated tool set with a
backbone infrastructure designed for this workflow as well as for the specific high resolution task. In this paper we
concentrate on masks with feature sizes relevant for the 45nm node and defects with typical size and shape as they
appear in production. Phase shifting masks with synthetic defects have been manufactured and the printability of the
defects is analyzed with an AIMSTM45-193i. In part the defect outline and three-dimensional shape as well as further
characteristics have been visualized with an electron microscope, prior to repairing them with an electron beam based
repair system. In addition we will show the behaviour of the phase of the mask in a region of interest, that is in this case
the repair area and its immediate vicinity. This will be done by a special new tool, named Phame®, developed for
measuring the actual phase of smallest mask features with a high spatial resolution.
In the conclusion we will give an outlook how the proposed workflow and the how the employed technologies will
influence the masks that are expected to emerge for the 32nm node.
With the continuing decrease of feature sizes in conjunction with both the enormous costs for current masks and
projections for future generations the area of mask repair has often been highlighted. Clearly, a viable repair
methodology going forward has the potential to significantly influence and reduce production costs for the complete
mask set. Carl Zeiss SMS had, in a concerted development effort with other Zeiss daughter companies, succeeded to
develop and deploy a novel mask repair tool capable of repairing specifically all types of advanced masks, such as quartz
binary masks, phase shift masks, EUV masks and S-FIL imprint templates. In addition to the pure technical capability of
the e-beam based approach a strong emphasis has been made towards the user friendliness and automation features of the
repair process as such.
With the ever decreasing feature sizes and increasing cost of current and future photolithographic masks the repair of these masks becomes a substantial factor of the total mask production cost. In collaboration NaWoTec GmbH, Carl Zeiss Nano Technology Systems Division and Carl Zeiss Semiconductor Metrology Systems Division have launched a mask repair tool capable of processing a wide variety of mask types, such as quartz binary masks, phase shift masks, EUV masks, and e-beam projection stencil masks. In this paper, besides a brief overview of the tool platform, we will present the automated repair of clear and opaque defects on Cr and MoSi quartz masks. Emphasis will be put onto the resolution and the speed of the repair procedure and the high grade of automation and integration achievable in the repair of highend photomasks. An outlook against the ITRS requirements and the extendibility of the presented solution to further technology nodes will be given in the summary.
The continued device scaling in the semiconductor industry has resulted in an acceleration of the respective technology roadmaps worldwide, which in turn is reflected in the constant pull-in of the lithography roadmaps. From the lithography toolmaker point of view this situation had to be answered with a consistent integrated equipment development roadmap. The general toolkit philosophy of the Leica ZBA300 family of E- beam systems incorporates such features and results in a harmonization of the development and usage of e-beam tools over a wide range of device generations. The theoretical advantages of shaped beam systems over raster scan in terms of edge definition as well as in terms of writing times become especially obvious when advanced masks with the emerging reticle enhancements like OPC are taken into account. It is the successful application of such techniques that will make the production of reticles for the 0.18 micron generation and below a commercially feasible enterprise.
Since production started at the Photronics site in Manchester, England, mask writing capability had been centered on laser based technology. The Manchester site has now taken delivery of its first e-beam system: the ZBA 31H+, manufactured by Leica Microsystems Lithography GMBH. The ZBA 31H+) system was designed for the production of reticles utilizing 250 nanometer design technology and is expected to play a key role in Photronics' future reticle development. The addition of an e-beam system to the current laser based technology, in this instance, has been driven by increasing customer demand and the requirement for reticles containing high resolution OPC structures. The ZBA 31H+) is a variable shaped spot, vector scan electron beam lithography system operating at 20 keV. Enhancements from the previous generation system include improved deflection systems, stage metrology, pattern data handling, and an address grid down to 10 nanometers. This system's specified performance enablers it to produce reticles designed to support semiconductor fabrication utilizing 250 nanometer design rules, and beyond, with high accuracy and productivity.
Mask technology has often been considered an enabling for semiconductor fabrication. But today photomasks have evolved to a bottle neck in the every increasing integration process of semiconductor circuits. Regarding to the 1997 SIA roadmap there are very stringent requirements for mask making. Even with the momentary weak Asian market the worldwide demand for reticles will continue to grow. The anticipation of larger reticles has been discussed over years. What ever the reason for the need of larger reticles, the move to the 230 mm X 230 mm reticle size will provide size will provide unique challenges to both the mask equipment manufacturers and mask fabricator. Next Generation Lithography together with their mask techniques are in development and try to come into the market.
The world semiconductor industry is currently preparing itself for the next evolutionary step in the ongoing development of the integrated circuit, characterized by the 0.18 to 0.15 micrometer technology. The already complex engineering task for the mask tool makers is furthermore complicated by the introduction of the new SEMI reticle standard with a 230 mm by 230 mm large and 9 mm thick quartz glass blank that will have a weight of more than one kilogram. The production of these advanced masks is already identified as a key enabling technology which will stretch the capabilities of the manufacturing process, and its equipment, to the limit. The mask making e-beam system Leica ZBA320, capable of exposing a 230 mm reticle and featuring the variable shaped beam approach with a 20 kV accelerating voltage has been introduced recently. Now the first results of e-beam exposures with this new type of mask writer are presented. Enhancements form the previous generation system include improved deflection systems, stage metrology, pattern data handling, and an address grid down to 10 nanometers. This system's specified performance enables it to produce reticles designed to support semiconductor fabrication utilizing 180 nanometer design rules, and beyond, with high accuracy and productivity.
The world semiconductor industry is currently preparing itself for the next evolutionary step in the ongoing development of the integrated circuit, characterized by the 0.18 micrometers technology. These circuits will invariably be produced using conventional optical lithography techniques, but based on advanced photomasks reticles, with the possible assistance of new lithography techniques such as phase shift and optical proximity correction. As such, these reticles will need to be built to very much tighter specifications, with more complex patterns, and at very much smaller geometries, then current technologies. To add to the already complex engineering task for the mask tool makers, the new SEMI reticle standard will introduce a 230 mm by 230 mm large and 9 mm thick quartz glass blank that will have a weight of above one kilogram. The production of these advanced masks is therefore identified as a key enabling technology which will stretch the capabilities of the manufacturing process, and its equipment, to the limit.
The constantly growing metrology requirements on photomasks in conjunction with an explosion of pattern file sizes have renewed the interest in alternative electron beam writer approaches. One possible way to cope with these requirements is an e-beam writer employing the variable shaped beam principle. Besides the straightforward reduction in pattern file sizes in general, this approach also seems the ideal way to incorporate the optical proximity correction features that are characteristic for many of the high-end applications the mask making industry has been confronted with recently. By designing a new e-beam system for industrial use compactness and ease of operation have been a central concern in order to get rid of the problems electron beam lithography systems have been notorious for in the past. A lithography system for use around the turn of this century should be able to expose the next standard reticle sizes, consequently the ZBA31H is already available with a large glass option incorporating the Leica 300 mm stage subsystem.
It is now widely accepted that variable shaped beam ( VSB ) writers have some
significant advantages compared to the gaussian principle systems, especially
when throughput is considered. The ZBA variable shaped beam system
introduced in this paper is the most advanced mask generator from Jenoptik
Germany. We have utilized the VSB electron optical concept from the very
beginning of designing e-beam systems of the ZBA-series more than 20 years
ago. The unique combination of this longstanding experience, more than 120
systems were constructed and comissioned, with some very recent developments
in the software and operation logistics of the system, allow the ZBA31H
maskwriter system to provide the complete performance that is required to
satisfy the demands of the 1 G-DRAM generation masks.
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