Distributed circuit models (DCM) divide photovoltaic devices into discrete elementary units. Each unit is assigned an equivalent circuit based on geometry and location, with circuit parameters being fit to or extrapolated from experimental results. Interconnection of these elementary units with ohmic resistors representing lateral and vertical resistances within the layers of the device forms the complete circuit model. DCMs allow grid design optimization, simulation of chromatic aberration, luminescent coupling and analysis of power losses due to regionally specific resistances, which are not possible with simple lumped models. Previous DCMs have been limited to 1-3 junction devices, using a 2D surface model, or use of a one-diode circuit model for the cell junctions. Furthermore, a DCM can be used to simulate complex multi-junction devices with non-uniform illumination, whereas in comprehensive physics-based simulators like Synopsys TCAD Sentaurus this would require vastly greater computational resources.
In this work, a parameterized 3D distributed circuit model was developed to calculate the performance of III-V solar cells and photonic power converters (PPC) with a variable number of epitaxially stacked pn junctions. We validated these calculations against published results using a similar 3D model for a 1-junction solar cell. Furthermore, experimental results from Azastra Opto’s 20-junction PPC illuminated by an 845 nm diode laser are compared. These devices are designed with many pn junctions to achieve higher voltages and to operate under non-uniform illumination profiles from a laser or LED. The effect on device performance of varying both these parameters will be discussed.
A monolithic compound semiconductor phototransducer optimized for narrow-band light sources was designed for and has achieved conversion efficiencies exceeding 50%. The III-V heterostructure was grown by MOCVD, based on the vertical stacking of a number of partially absorbing GaAs n/p junctions connected in series with tunnel junctions. The thicknesses of the p-type base layers of the diodes were engineered for optimal absorption and current matching for an optical input with wavelengths centered in the 830 nm to 850 nm range. The device architecture allows for improved open-circuit voltage in the individual base segments due to efficient carrier extraction while simultaneously maintaining a complete absorption of the input photons with no need for complicated fabrication processes or reflecting layers. Progress for device outputs achieving in excess of 12 V is reviewed in this study.
PV devices with active areas of ~3:4 mm2 were fabricated and tested with top electrodes having different emitter gridline spacings with active area shadowing values between 0% and 1.8%. As expected, the thicker n/p junctions exhibit hindered photocarrier extraction, with low fill factor (FF) values, for devices prepared with sparse gridline designs. However, this study clearly demonstrates that for thin n/p junctions photocarrier extraction can still be efficient (FF > 80%) even for devices with no gridlines, which we explain using a TCAD model. The electric field profiles of devices with and without hindered photocarrier extraction are also discussed.
A twelve-junction monolithically-integrated GaAs phototransducer device with >60% power conversion efficiency and >14 V open-circuit voltage under monochromatic illumination is presented. Drift-diffusion based simulations including a luminescent coupled generation term are used to study photon recycling and luminescent coupling between each junction. We find that luminescent coupling effectively redistributes any excess generated photocurrent between all junctions leading to reduced wavelength sensitivity. This broadened response is consistent with experimental measurements of devices with high-quality materials exhibiting long carrier lifetimes. Photon recycling is also found to significantly improve the voltage of all junctions, in contrast to multi-junction solar cells which utilize junctions of differing bandgaps and where high-bandgap junctions benefit less from photon recycling.
The high-efficiency conversion of photonic power into electrical power is of broad-range applicability to many industries due to its electrical isolation from the surrounding environment and immunity to electromagnetic interference which affects the performance and reliability of sensitive electronics. A photonic power converter, or phototransducer, can absorb several watts of infrared laser power transmitted through a multimode fiber and convert this to electrical power for remote use. To convert this power into a useful voltage, we have designed, simulated, and fabricated a photovoltaic phototransducer that generates >5 V using a monolithic, lattice-matched, vertically-stacked, single-cell device that eliminates complex fabrication and assembly steps. Experimental measurements have demonstrated a conversion efficiency of up to 60.1% under illumination of ~11 W/cm2 at a wavelength of 835 nm, while simulations indicate that efficiencies reaching 70% should be realistically achievable using this novel design.
Triple-junction AlGaInP/InGaAs/Ge solar cells with embedded InAs quantum dots are presented, where typical
samples obtain efficiencies of > 40% under AM1.5D illumination, over a range of concentrations of 2- to 800-suns
(2 kW/m2 to 800 kW/m2). Quantum efficiency measurements show that the embedded quantum dots improve the
absorption of the middle subcell in the wavelength range of 900-940 nm, which in turn increases the overall
operating current of the solar cell. These results are obtained with 1 cm2 solar cells, and they demonstrate the
solar cells' low series resistance, which and makes them ideal for the current generation in commercial
concentrator systems. The thermal management and reliability of the solar cell and carrier is demonstrated by
testing the experimental samples under flash (up to 1000-suns) solar simulator and continuous (up to 800-suns)
solar simulator. Under continuous solar illumination, the solar cell temperature varies between ~Δ3°C at 260-suns
linearly to ~Δ33°C at 784-suns when the solar cell is mounted with thermal paste, and ~Δ27°C at 264-suns linearly
to ~Δ91°C at 785-suns when no thermal paste is used. The solar cells experience the expected shift in open circuit
voltage and efficiency due to temperature, but otherwise operate normally for extended periods of time.
Photovoltaic solar cells are a route towards local, environmentally benign, sustainable and affordable energy solutions.
Antireflection coatings are necessary to input a high percentage of available light for photovoltaic conversion, and
therefore have been widely exploited for silicon solar cells. Multi-junction III-V semiconductor solar cells have achieved
the highest efficiencies of any photovoltaic technology, yielding up to 40% in the laboratory and 37% in commercial
devices under varying levels of concentrated light. These devices benefit from a wide absorption spectrum (300-
1800 nm), but this also introduces significant challenges for antireflection coating design. Each sub-cell junction is
electrically connected in series, limiting the overall device photocurrent by the lowest current-producing junction.
Therefore, antireflection coating optimization must maximize the current from the limiting sub-cells at the expense of
the others. Solar concentration, necessary for economical terrestrial deployment of multi-junction solar cells, introduces
an angular-dependent irradiance spectrum. Antireflection coatings are optimized for both direct normal incidence in air
and angular incidence in an Opel Mk-I concentrator, resulting in as little as 1-2% loss in photocurrent as compared to an
ideal zero-reflectance solar cell, showing a similar performance to antireflection coatings on silicon solar cells. A transparent conductive oxide layer has also been considered to replace the metallic-grid front electrode and for inclusion as part of a multi-layer antireflection coating. Optimization of the solar cell, antireflection coating, and concentrator system should be considered simultaneously to enable overall optimal device performance.
A subtle roughening of the surface of a buried 60 nm InGaAs epitaxial layer was detected using a combination of sample cleaving, selective chemical etching and Field Emission Scanning Electron Microscopy (FESEM). In our technology, InGaAs is the photo-absorbing layer of Metal Organic Chemical Vapor Deposition (MOCVD) grown layers used in the monolithic integration of active photo detectors and a passive mux/demux. Conventional Photo-Luminescence (PL) and X-Ray Diffraction (XRD) techniques used to monitor and optimize the growth of epitaxial layers did not show this microscopic surface roughness. The appearance of roughness in the InGaAs layer was linked to very large changes in the dislocation density of the layers grown over the rough surface. Increases of up to three orders of magnitude in the Etch Pit Density (EPD from 104 to 107 cm-2) were revealed using a standard Huber Etch. The Huber Etch also showed the preferred formation of "pairs" of dislocations threading out from a common point on the rough InGaAs surface. Changes in growth conditions resulted in the complete elimination of roughness and of excessive dislocation densities
A thin layer of INGaAs is the critical photo-absorbing layer in epitaxially grown layers used in the monolithic integration of active photodetectors and a passive mux/demux. This thin InGaAs active layer requires tight thickness control that is beyond the accuracy and reproducibility of conventional thickness measurement techniques such as a step-height profilometer. In order to address this issue, a technique using Field Emission Scanning Electron Microscopy (FESEM) combined with a chemical delineation etch (use to reveal thin layers) was developed. The etch used was dilute H2SO4:H2O2:H20 which will etch all ternaries and quaternaries but does not etch InP. The selectivity of this etch, between the ternary InGaAs material and the InP, was measured to be approximately 500:1. We found that using the FESEM technique provided a minimum measurable thickness of approximately 50 nm, with a precision of approximately 5 nm. The accuracy of our measurement was verified by TEM analysis on selected samples. We also found that SIMS data, obtained from an independent analytical laboratory and originally performed to monitor doping levels in the layers, could be used to monitor the thickness and/or the variations in composition of the thin InGaAs photo-absorbing layer. The key is to make use of the integrated SIMS peaks rather than the full-width-half-maximum (FWHM) of the peaks. For an InGaAs layer, the integrated arsenic SIMS signal varies with the layer thickness and the arsenic concentration. The variations in either of these, in different growth batches, can be detected by SIMS. We found that using integrated SIMS profiles gives a fully independent thickness and/or compositional control monitor to compare with our FESEM measurements and can be used as a trusted control fo the layer quality. This comes at no additional cost since in our case, SIMS profiles are required to monitor doping levels. In this paper, a correlation is shown between the thickness of a thin layer of InGaAs measured by FESEM and the integrated arsenic SIMS peaks from several independent epitaxial growths. Deviations from the norm are explained from small thickness or compositional changes as supported by FESEM and photo-luminescence measurements.
Polarized ultraviolet light from an excimer laser (193 nm) was used to photodesorb and photodissociate N2O and NH3 adsorbed on a cold Pt(111) surface. The photodesorbed species and their time-of-flight (TOF) were monitored by Resonantly Enhanced Multiphoton Ionization spectroscopy. For N2O, we have observed both the ejection of ballistic O atoms and the release of slow thermalized N2 molecules. The ballistic oxygen atoms leave the surface either in the ground state O(3P) or in the first electronically excited state O(1D). A lobular angular distribution pointing away from the surface normal was measured for the ballistic O(3P) in agreement with a binding geometry where the linear N2O is tilted N-end down on the Pt(111) surface. Evidence for the production of N2 photofragments thermalized by the surface includes both low (approximately 90 K) rotational and translational temperatures of the N2 as well as a lack of correlation between rotational and translational energy. For NH3 the irradiation of a submonolayer coverage largely favors the desorption rather than the dissociation of NH3. For multilayer coverages however, a strong dissociation channel is activated and atomic H is seen to desorb from the surface. A bimodal distribution was found for the TOF of the H photofragments. The fastest channel (0.7 eV) corresponds to the ejection of undeflected ballistic H fragments produced near the surface. For bulk NH3 photodissociated deep within the multilayer, the TOF of the H radicals shows an unexpected thermalized distribution.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.